Configuration Features Backplane Architecture : Orthogonal Number of Positions : 1 PCB Mount Orientation : Right Angle
Contact Features Contact Current Rating (Max) (AMP) : 35 Contact Type : Pin
Electrical Characteristics Operating Voltage (VAC) : 100 Operating Voltage (VDC) : 100
Housing Features Centerline (Pitch) : 6 MM [.236 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Power
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Type : PCB Mount Header
Termination Features Termination Method to PCB : Through Hole - Solder
Usage Conditions Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
Configuration Features
- Backplane Architecture : Orthogonal
- Number of Positions : 1
- PCB Mount Orientation : Right Angle
Contact Features
- Contact Current Rating (Max) (AMP) : 35
- Contact Type : Pin
Electrical Characteristics
- Operating Voltage (VAC) : 100
- Operating Voltage (VDC) : 100
Housing Features
- Centerline (Pitch) : 6 MM [.236 INCH ]
Mechanical Attachment
- Connector Mounting Type : Board Mount
Operation/Application
- Circuit Application : Power
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
- PCB Connector Type : PCB Mount Header
Termination Features
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -40 - 105 DEGC [-40 - 221 DEGF ]
