Body Features Frame Style : C Shape
Configuration Features Grid Spacing : .9906 x .8585 MM [.039 x .0338 INCH ] Number of Positions : 2092
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 IC Socket Type : LGA 4189
Housing Features Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray Tray Color : Blue
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range (DEGC) : -25 - 100
Body Features Frame Style : C Shape
Configuration Features Grid Spacing : .9906 x .8585 MM [.039 x .0338 INCH ] Number of Positions : 2092
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 30 IC Socket Type : LGA 4189
Housing Features Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray Tray Color : Blue
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board
Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
Usage Conditions Operating Temperature Range (DEGC) : -25 - 100
Body Features
Frame Style : C Shape
Configuration Features
Grid Spacing : .9906 x .8585 MM [.039 x .0338 INCH ]
Number of Positions : 2092
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : .5
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICIN) : 30
IC Socket Type : LGA 4189
Housing Features
Housing Color : Black
Housing Material : High Temperature Thermoplastic
Industry Standards
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Tray
Tray Color : Blue
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
Termination Features
Termination Method to Printed Circuit Board : Surface Mount - Solder Ball
