TE Connectivity LGA Sockets 1-2324271-3

Description
Body Features Frame Style : C Shape Configuration Features Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ] Number of Positions : 2092 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] IC Socket Type : LGA 4189 Housing Features Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Tray Color : Blue Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Termination Features Termination Method to PCB : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]
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Description
Body Features Frame Style : C Shape Configuration Features Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ] Number of Positions : 2092 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] IC Socket Type : LGA 4189 Housing Features Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Tray Color : Blue Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Termination Features Termination Method to PCB : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
LGA Sockets - 1-2324271-3 - TE Connectivity
Berwyn, PA, United States
LGA Sockets
1-2324271-3
LGA Sockets 1-2324271-3
Body Features Frame Style : C Shape Configuration Features Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ] Number of Positions : 2092 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ] IC Socket Type : LGA 4189 Housing Features Housing Color : Black Housing Material : High Temperature Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Tray Tray Color : Blue Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Termination Features Termination Method to PCB : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]

Body Features


  • Frame Style : C Shape

Configuration Features


  • Grid Spacing : .9906 x .8585 MM  [.039 x .0338 INCH ]
  • Number of Positions : 2092

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : .5
  • Contact Mating Area Plating Material : Gold (Au)
  • Contact Mating Area Plating Material Thickness : .38 MICM  [15 MICIN ]
  • IC Socket Type : LGA 4189

Housing Features


  • Housing Color : Black
  • Housing Material : High Temperature Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Tray
  • Tray Color : Blue

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board

Termination Features


  • Termination Method to PCB : Surface Mount - Solder Ball

Usage Conditions


  • Operating Temperature Range : -25 - 100 DEGC  [-13 - 212 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 1-2324271-3
Product Name LGA Sockets
Product Type IC Socket
Socket Type LGA
Mounting SMT; Board Mount
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