Body Features Connector Profile : Standard Ejector Location : Both Ends Ejector Material : High Temperature Thermoplastic Ejector Material Color : Natural Ejector Type : Standard Latch Color : Natural Latch Material : High Temperature Thermoplastic Module Key Type : Offset Right
Configuration Features Module Orientation : Vertical Number of Keys : 1 Number of Positions : 288
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .75 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Underplating Material : Nickel Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Tin Socket Style : DIMM
Electrical Characteristics DRAM Voltage (V) : 1.2
Housing Features Centerline (Pitch) : .85 MM [.033 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Alignment Type : Offset Right
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Bus Bar DRAM Type : Double Data Rate (DDR) 4
Termination Features Insertion Style : Direct Insert Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
- Connector Profile : Standard
- Ejector Location : Both Ends
- Ejector Material : High Temperature Thermoplastic
- Ejector Material Color : Natural
- Ejector Type : Standard
- Latch Color : Natural
- Latch Material : High Temperature Thermoplastic
- Module Key Type : Offset Right
Configuration Features
- Module Orientation : Vertical
- Number of Keys : 1
- Number of Positions : 288
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : .75
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
- Contact Underplating Material : Nickel
- Memory Socket Type : Memory Card
- PCB Contact Termination Area Plating Material : Tin
- Socket Style : DIMM
Electrical Characteristics
Housing Features
- Centerline (Pitch) : .85 MM [.033 INCH ]
- Housing Color : Black
- Housing Material : High Temperature Thermoplastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : Without
- Mating Alignment Type : Offset Right
Operation/Application
- Circuit Application : Signal
Packaging Features
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Bus Bar
- DRAM Type : Double Data Rate (DDR) 4
Termination Features
- Insertion Style : Direct Insert
- Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
