TE Connectivity Data Connectivity Headers 1-2286550-1

Body Features

• Body Material : Zinc Alloy, PPA GF25
• Connector & Keying Code : G
• PCB Retention Feature Plating Material : Tin

Configuration Features

• Number of Positions : 6
• Number of Rows : 2
• PCB Mount Orientation : Horizontal

Contact Features

• Center Contact : With
• Contact Current Rating (Max) (AMP) : 2.5
• Contact Mating Area Plating Material : Gold (Au)
• Contact Type : Pin
• Mating Pin Diameter : .6 MM  [.02 INCH ]
• Mating Tab Thickness : .63 MM  [.02 INCH ]
• Mating Tab Width : .63 MM  [.02 INCH ]
• Outer Contact Plating Material : Tin (Sn)
• RF Connector Center Contact Plating Material : Gold (Au)

Dimensions

• Connector Height : 8.5 MM  [.334 INCH ]
• Product Length : 15.65 MM  [.616 INCH ]
• Product Width : 27.3 MM  [1.074 INCH ]

Electrical Characteristics

• Impedance (OHM) : 100
• Operating Voltage (VDC) : 60

Housing Features

• Centerline (Pitch) : 2 MM  [.07 INCH ]
• Housing Color : Gray

Mechanical Attachment

• Connector Mounting Type : Board Mount
• Mating Retention : With
• PCB Mount Retention : With
• PCB Mount Retention Type : Solder Tail

Operation/Application

• Assembly Process Feature : Board Standoff
• Circuit Application : Signal
• Operating Frequency Range (GHZ) : 0 - 3
• Shielded : Yes
• Solder Process : Reflow Solder Capable

Other

• Dielectric Material : PA GF
• Interface Number : 114-94444

Packaging Features

• Packaging Method : Reel
• Packaging Quantity : 300

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector System : Wire-to-Board, Board-to-Board
• Mixed & Hybrid Connector : Yes
• Sealable : No

Termination Features

• Termination Method to PCB : Through Hole - Solder

Usage Conditions

• Operating Temperature (Max) : 105 DEGC  [221 DEGF ]
• Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]

HSD+2MQS,HDR ASSY,90DEG,COD G