TE Connectivity Data Connectivity Headers 1-2208264-3

Description
Body Features Body Material : PA Connector & Keying Code : A PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 2 PCB Mount Orientation : Vertical Contact Features Center Contact : Without Contact Mating Area Plating Material : Unplated RF Connector Center Contact Plating Material : None Dimensions Connector Height : 6.5 MM  [.255 INCH ] Product Length : 15 MM  [.59 INCH ] Product Width : 24 MM  [.944 INCH ] Housing Features Centerline (Pitch) : 6 MM  [.236 INCH ] Housing Color : Other Industry Standards Agency/Standard : MOST IP Rating : IP54K Mechanical Attachment Mating Retention : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : Board Standoff Shielded : Yes Other Dielectric Material : None Solder Process : Reflow Packaging Features Packaging Method : Box & Tray Packaging Quantity : 605 Product Type Features Connector System : Wire-to-Device Hybrid Connector : No Sealable : No Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 65 DEGC , 85 DEGC , 90 DEGC , 75 DEGC , 80 DEGC , 70 DEGC  [185 DEGF , 167 DEGF , 149 DEGF , 158 DEGF , 176 DEGF , 194 DEGF ] Operating Temperature Range : -40 - 95 DEGC  [-40 - 203 DEGF ]
  • Data Connectivity Headers - 1-2208264-3 - TE Connectivity
    TE Connectivity
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Description
Body Features Body Material : PA Connector & Keying Code : A PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 2 PCB Mount Orientation : Vertical Contact Features Center Contact : Without Contact Mating Area Plating Material : Unplated RF Connector Center Contact Plating Material : None Dimensions Connector Height : 6.5 MM  [.255 INCH ] Product Length : 15 MM  [.59 INCH ] Product Width : 24 MM  [.944 INCH ] Housing Features Centerline (Pitch) : 6 MM  [.236 INCH ] Housing Color : Other Industry Standards Agency/Standard : MOST IP Rating : IP54K Mechanical Attachment Mating Retention : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : Board Standoff Shielded : Yes Other Dielectric Material : None Solder Process : Reflow Packaging Features Packaging Method : Box & Tray Packaging Quantity : 605 Product Type Features Connector System : Wire-to-Device Hybrid Connector : No Sealable : No Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 65 DEGC , 85 DEGC , 90 DEGC , 75 DEGC , 80 DEGC , 70 DEGC  [185 DEGF , 167 DEGF , 149 DEGF , 158 DEGF , 176 DEGF , 194 DEGF ] Operating Temperature Range : -40 - 95 DEGC  [-40 - 203 DEGF ]
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Suppliers

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Data Connectivity Headers - 1-2208264-3 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Data Connectivity Headers
1-2208264-3
Data Connectivity Headers 1-2208264-3
Body Features Body Material : PA Connector & Keying Code : A PCB Retention Feature Plating Material : Tin Configuration Features Number of Positions : 2 PCB Mount Orientation : Vertical Contact Features Center Contact : Without Contact Mating Area Plating Material : Unplated RF Connector Center Contact Plating Material : None Dimensions Connector Height : 6.5 MM  [.255 INCH ] Product Length : 15 MM  [.59 INCH ] Product Width : 24 MM  [.944 INCH ] Housing Features Centerline (Pitch) : 6 MM  [.236 INCH ] Housing Color : Other Industry Standards Agency/Standard : MOST IP Rating : IP54K Mechanical Attachment Mating Retention : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : Board Standoff Shielded : Yes Other Dielectric Material : None Solder Process : Reflow Packaging Features Packaging Method : Box & Tray Packaging Quantity : 605 Product Type Features Connector System : Wire-to-Device Hybrid Connector : No Sealable : No Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature (Max) : 65 DEGC , 85 DEGC , 90 DEGC , 75 DEGC , 80 DEGC , 70 DEGC  [185 DEGF , 167 DEGF , 149 DEGF , 158 DEGF , 176 DEGF , 194 DEGF ] Operating Temperature Range : -40 - 95 DEGC  [-40 - 203 DEGF ]

Body Features


  • Body Material : PA
  • Connector & Keying Code : A
  • PCB Retention Feature Plating Material : Tin

Configuration Features


  • Number of Positions : 2
  • PCB Mount Orientation : Vertical

Contact Features


  • Center Contact : Without
  • Contact Mating Area Plating Material : Unplated
  • RF Connector Center Contact Plating Material : None

Dimensions


  • Connector Height : 6.5 MM  [.255 INCH ]
  • Product Length : 15 MM  [.59 INCH ]
  • Product Width : 24 MM  [.944 INCH ]

Housing Features


  • Centerline (Pitch) : 6 MM  [.236 INCH ]
  • Housing Color : Other

Industry Standards


  • Agency/Standard : MOST
  • IP Rating : IP54K

Mechanical Attachment


  • Mating Retention : Without
  • PCB Mount Retention : Without

Operation/Application


  • Assembly Process Feature : Board Standoff
  • Shielded : Yes

Other


  • Dielectric Material : None
  • Solder Process : Reflow

Packaging Features


  • Packaging Method : Box & Tray
  • Packaging Quantity : 605

Product Type Features


  • Connector System : Wire-to-Device
  • Hybrid Connector : No
  • Sealable : No

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Solder

Usage Conditions


  • Operating Temperature (Max) : 65 DEGC , 85 DEGC , 90 DEGC , 75 DEGC , 80 DEGC , 70 DEGC  [185 DEGF , 167 DEGF , 149 DEGF , 158 DEGF , 176 DEGF , 194 DEGF ]
  • Operating Temperature Range : -40 - 95 DEGC  [-40 - 203 DEGF ]
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Technical Specifications

  TE Connectivity
Product Category Electrical Connectors
Product Number 1-2208264-3
Product Name Data Connectivity Headers
Termination Through Hole - Solder
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