TE Connectivity DIP Sockets 1-2199300-2

Description
Body Features Connector Profile : Standard Frame Style : Open Sleeve Material : Brass/Copper Sleeve Plating Material : Tin/Lead Configuration Features Number of Positions : 32 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness (MICIN) : 60 Contact Type : Pin IC Socket Type : DIP Mating Contact Type : Dual Leaf PCB Contact Termination Area Plating Material : Tin Dimensions Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 20 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Color : Black Housing Material : Polyester Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Box & Tube, Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
DIP Sockets - 1-2199300-2 - TE Connectivity
Berwyn, PA, United States
DIP Sockets
1-2199300-2
DIP Sockets 1-2199300-2
Body Features Connector Profile : Standard Frame Style : Open Sleeve Material : Brass/Copper Sleeve Plating Material : Tin/Lead Configuration Features Number of Positions : 32 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness (MICIN) : 60 Contact Type : Pin IC Socket Type : DIP Mating Contact Type : Dual Leaf PCB Contact Termination Area Plating Material : Tin Dimensions Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 20 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Color : Black Housing Material : Polyester Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Box & Tube, Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Frame Style : Open
  • Sleeve Material : Brass/Copper
  • Sleeve Plating Material : Tin/Lead

Configuration Features


  • Number of Positions : 32
  • Number of Rows : 2
  • PCB Mount Orientation : Vertical

Contact Features


  • Contact Base Material : Phosphor Bronze
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Fabrication : Stamped & Formed
  • Contact Mating Area Plating Material : Tin
  • Contact Mating Area Plating Material Thickness (MICIN) : 60
  • Contact Type : Pin
  • IC Socket Type : DIP
  • Mating Contact Type : Dual Leaf
  • PCB Contact Termination Area Plating Material : Tin

Dimensions


  • Row-to-Row Spacing : 15.24 MM  [.6 INCH ]

Electrical Characteristics


  • Contact Resistance (MOHM) : 20
  • Insulation Resistance (MEGO) : 1000

Housing Features


  • Centerline (Pitch) : 2.54 MM  [.1 INCH ]
  • Housing Color : Black
  • Housing Material : Polyester

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Polarization

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Box & Tube, Tube

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Leg Style : Through Hole

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Solder

Usage Conditions


  • Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
Supplier's Site Datasheet

Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 1-2199300-2
Product Name DIP Sockets
Product Type IC Socket
Socket Type DIP
Mounting Board Mount
Current Rating 1 amps
Insulation Resistance 1000 Mohms
Unlock Full Specs
to access all available technical data

Similar Products

PCB Headers & Receptacles - 102973-3 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details
PCB Headers & Receptacles - 103747-2 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details
PCB Headers & Receptacles - 103906-1 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details
PCB Headers & Receptacles - 103361-3 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Current Rating 3 amps
View Details