TE Connectivity DIP Sockets 1-2199299-5

Description
Body Features Connector Profile : Standard Frame Style : Ladder Sleeve Material : Brass/Copper Sleeve Plating Material : Tin/Lead Configuration Features Number of Positions : 40 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness (MICIN) : 60 Contact Type : Pin IC Socket Type : DIP Mating Contact Type : Dual Leaf PCB Contact Termination Area Plating Material : Tin Dimensions Profile Height from PCB : 5.1 MM  [.2 INCH ] Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 20 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Color : Black Housing Material : PBT GF30 Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Box & Tube, Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 3 MM  [.118 INCH ] Usage Conditions Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
DIP Sockets - 1-2199299-5 - TE Connectivity
Berwyn, PA, United States
DIP Sockets
1-2199299-5
DIP Sockets 1-2199299-5
Body Features Connector Profile : Standard Frame Style : Ladder Sleeve Material : Brass/Copper Sleeve Plating Material : Tin/Lead Configuration Features Number of Positions : 40 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 1 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness (MICIN) : 60 Contact Type : Pin IC Socket Type : DIP Mating Contact Type : Dual Leaf PCB Contact Termination Area Plating Material : Tin Dimensions Profile Height from PCB : 5.1 MM  [.2 INCH ] Row-to-Row Spacing : 15.24 MM  [.6 INCH ] Electrical Characteristics Contact Resistance (MOHM) : 20 Insulation Resistance (MEGO) : 1000 Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Housing Color : Black Housing Material : PBT GF30 Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization Operation/Applicatio n Circuit Application : Signal Packaging Features Packaging Method : Box & Tube, Tube Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Through Hole Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 3 MM  [.118 INCH ] Usage Conditions Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]

Body Features


  • Connector Profile : Standard
  • Frame Style : Ladder
  • Sleeve Material : Brass/Copper
  • Sleeve Plating Material : Tin/Lead

Configuration Features


  • Number of Positions : 40
  • Number of Rows : 2
  • PCB Mount Orientation : Vertical

Contact Features


  • Contact Base Material : Phosphor Bronze
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Fabrication : Stamped & Formed
  • Contact Mating Area Plating Material : Tin
  • Contact Mating Area Plating Material Thickness (MICIN) : 60
  • Contact Type : Pin
  • IC Socket Type : DIP
  • Mating Contact Type : Dual Leaf
  • PCB Contact Termination Area Plating Material : Tin

Dimensions


  • Profile Height from PCB : 5.1 MM  [.2 INCH ]
  • Row-to-Row Spacing : 15.24 MM  [.6 INCH ]

Electrical Characteristics


  • Contact Resistance (MOHM) : 20
  • Insulation Resistance (MEGO) : 1000

Housing Features


  • Centerline (Pitch) : 2.54 MM  [.1 INCH ]
  • Housing Color : Black
  • Housing Material : PBT GF30

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : With
  • Mating Alignment Type : Polarization

Operation/Application


  • Circuit Application : Signal

Packaging Features


  • Packaging Method : Box & Tube, Tube

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Leg Style : Through Hole

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Solder
  • Termination Post & Tail Length : 3 MM  [.118 INCH ]

Usage Conditions


  • Operating Temperature Range : -40 - 105 DEGC  [-40 - 221 DEGF ]
Supplier's Site Datasheet
Yishun, Singapore
Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
1363450-1-2199299-5
Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets 1363450-1-2199299-5
Win Source Part Number: 1363450-1-2199299-5 Category: Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets Temperature Range - Operating: -40°C ~ 105°C Fake Threat In the Open Market: 60 pct. Type: DIP, 0.6" (15.24mm) Row Spacing MSL Level: 1 (Unlimited) Mfr: TE Connectivity AMP Connectors Series: Diplomate DL Package: Tube Product Status: Active Features: Open Frame Base Product Number: 2199299 Mounting Type: Through Hole HTSUS: 8536.69.4040 REACH Status: Vendor Undefined ECCN: EAR99 Current Rating (Amps): 1 A Pitch - Mating: 0.100" (2.54mm) Termination: Solder Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Finish - Post: Tin Material Flammability Rating: UL94 V-0 Contact Finish Thickness - Post: 60.0µin (1.52µm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Number of Positions or Pins (Grid): 40 (2 x 20) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Nickel Termination Post Length: 0.118" (3.00mm) Contact Resistance: 20mOhm

Win Source Part Number: 1363450-1-2199299-5
Category: Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Temperature Range - Operating: -40°C ~ 105°C
Fake Threat In the Open Market: 60 pct.
Type: DIP, 0.6" (15.24mm) Row Spacing
MSL Level: 1 (Unlimited)
Mfr: TE Connectivity AMP Connectors
Series: Diplomate DL
Package: Tube
Product Status: Active
Features: Open Frame
Base Product Number: 2199299
Mounting Type: Through Hole
HTSUS: 8536.69.4040
REACH Status: Vendor Undefined
ECCN: EAR99
Current Rating (Amps): 1 A
Pitch - Mating: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Finish - Post: Tin
Material Flammability Rating: UL94 V-0
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Number of Positions or Pins (Grid): 40 (2 x 20)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Nickel
Termination Post Length: 0.118" (3.00mm)
Contact Resistance: 20mOhm

Supplier's Site Datasheet

Technical Specifications

  TE Connectivity Win Source Electronics
Product Category IC Interconnect Components IC Interconnect Components
Product Number 1-2199299-5 1363450-1-2199299-5
Product Name DIP Sockets Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Product Type IC Socket IC Headers
Socket Type DIP
Mounting Board Mount Through-Hole; Through Hole
Current Rating 1 amps 1 amps
Insulation Resistance 1000 Mohms
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