Body Features Ejector Type : Standard
Configuration Features Module Orientation : Vertical Number of Positions : 288
Contact Features Contact Current Rating (Max) (AMP) : .75
Dimensions Row-to-Row Spacing : 2.2 MM [.08 INCH ]
Housing Features Centerline (Pitch) : .85 MM [.033 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 4
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features Ejector Type : Standard
Configuration Features Module Orientation : Vertical Number of Positions : 288
Contact Features Contact Current Rating (Max) (AMP) : .75
Dimensions Row-to-Row Spacing : 2.2 MM [.08 INCH ]
Housing Features Centerline (Pitch) : .85 MM [.033 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 4
Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
Ejector Type : Standard
Configuration Features
Module Orientation : Vertical
Number of Positions : 288
Contact Features
Contact Current Rating (Max) (AMP) : .75
Dimensions
Row-to-Row Spacing : 2.2 MM [.08 INCH ]
Housing Features
Centerline (Pitch) : .85 MM [.033 INCH ]
Mechanical Attachment
Connector Mounting Type : Board Mount
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Tray
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
DRAM Type : Double Data Rate (DDR) 4
Termination Features
Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
