Body Features Assembly Process Feature Material : Thermoplastic Primary Product Color : Black
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 24 PCB Mount Orientation : Vertical Stackable : Yes
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Layout : Inline Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .38 MICM [15 MICIN ] Contact Type : Hermaphroditic PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .05 MICM [2 MICIN ]
Dimensions Connector Height : 3.6 MM [.141 INCH ] Stack Height : 4 MM [.157 INCH ]
Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 2 Operating Voltage (VAC) : 30
Housing Features Centerline (Pitch) : .5 MM [.02 INCH ] Housing Material : Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization PCB Mount Alignment : Without PCB Mount Alignment Type : Locating Posts PCB Mount Retention : Without PCB Mount Retention Type : None
Operation/Applicatio
n Assembly Process Feature : Vacuum Cover Circuit Application : Signal
Packaging Features Packaging Quantity : 1100 Packaging Type : Tape & Reel
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board PCB Connector Assembly Type : PCB Mount Hermaphroditic Connector Sealable : No
Termination Features Rectangular Termination Post & Tail Thickness : .15 MM [.005 INCH ] Rectangular Termination Post & Tail Width : .2 MM [.008 INCH ] Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Housing Temperature Rating : High Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
Body Features
- Assembly Process Feature Material : Thermoplastic
- Primary Product Color : Black
Configuration Features
- Board-to-Board Configuration : Parallel
- Number of Positions : 24
- PCB Mount Orientation : Vertical
- Stackable : Yes
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : .5
- Contact Layout : Inline
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness : .38 MICM [15 MICIN ]
- Contact Type : Hermaphroditic
- PCB Contact Termination Area Plating Material : Gold
- PCB Contact Termination Area Plating Material Thickness : .05 MICM [2 MICIN ]
Dimensions
- Connector Height : 3.6 MM [.141 INCH ]
- Stack Height : 4 MM [.157 INCH ]
Electrical Characteristics
- Dielectric Withstanding Voltage (Max) (VAC) : 500
- Insulation Resistance (MEGO) : 2
- Operating Voltage (VAC) : 30
Housing Features
- Centerline (Pitch) : .5 MM [.02 INCH ]
- Housing Material : Thermoplastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : With
- Mating Alignment Type : Polarization
- PCB Mount Alignment : Without
- PCB Mount Alignment Type : Locating Posts
- PCB Mount Retention : Without
- PCB Mount Retention Type : None
Operation/Application
- Assembly Process Feature : Vacuum Cover
- Circuit Application : Signal
Packaging Features
- Packaging Quantity : 1100
- Packaging Type : Tape & Reel
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Board-to-Board
- PCB Connector Assembly Type : PCB Mount Hermaphroditic Connector
- Sealable : No
Termination Features
- Rectangular Termination Post & Tail Thickness : .15 MM [.005 INCH ]
- Rectangular Termination Post & Tail Width : .2 MM [.008 INCH ]
- Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions
- Housing Temperature Rating : High
- Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
