Contact Features Contact Base Material : Copper Alloy Contact Length : 27.03 MM [1.064 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.27 Contact Retention Within Housing : With Contact Type : Socket
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 3.94 MM [.155 INCH ]
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Length : 27.03 MM [1.064 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.27 Contact Retention Within Housing : With Contact Type : Socket
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 3.94 MM [.155 INCH ]
Contact Features Contact Base Material : Copper Alloy Contact Length : 27.03 MM [1.064 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.27 Contact Retention Within Housing : With Contact Type : Socket
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder Termination Post & Tail Length : 3.94 MM [.155 INCH ]
Contact Features
Contact Base Material : Copper Alloy
Contact Length : 27.03 MM [1.064 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICM) : 1.27
Contact Retention Within Housing : With
Contact Type : Socket
Mechanical Attachment
Contact Retention Type Within Housing : Retention Clip
Operation/Application
Solder Process Feature : Solder Dipped
Packaging Features
Packaging Method : Tray
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Solder
Termination Post & Tail Length : 3.94 MM [.155 INCH ]
