Body Features Primary Product Color : Black
Configuration Features Connector Contact Load Condition : Fully Loaded Number of Columns : 2 Number of Loaded Positions : 4 Number of Positions : 4 Number of Rows : 2 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : 7.5 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : .76 MICM [29.92 MICIN ] Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 1.75 MM [.069 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Finish : Matte PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
Dimensions Connector Height : 11.79 MM [.464 INCH ] Connector Length : 12.7 MM [.5 INCH ] Connector Width : 12.7 MM [.5 INCH ] Row-to-Row Spacing : 4.98 MM [.196 INCH ]
Electrical Characteristics Operating Voltage (VAC) : 600 Operating Voltage (VDC) : 600
Housing Features Centerline (Pitch) : 5 MM [.197 INCH ] Housing Material : PA 66
Industry Standards Agency/Standard : UL, VDE, CSA UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : With Mating Alignment Type : Polarization Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : With PCB Mount Retention Type : Screw Mount
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Quantity : 126 Packaging Type : Box
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Wire-to-Board Header Type : Fully Shrouded PCB Connector Assembly Type : PCB Mount Header Sealable : No
Termination Features Round Termination Post & Tail Diameter : .99 MM [.039 INCH ] Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Operating Temperature Range : -55 - 130 DEGC [-67 - 266 DEGF ]
Body Features
- Primary Product Color : Black
Configuration Features
- Connector Contact Load Condition : Fully Loaded
- Number of Columns : 2
- Number of Loaded Positions : 4
- Number of Positions : 4
- Number of Rows : 2
- PCB Mount Orientation : Vertical
Contact Features
- Contact Current Rating (Max) (AMP) : 7.5
- Contact Layout : Matrix
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Finish : Bright
- Contact Mating Area Plating Material Thickness : .76 MICM [29.92 MICIN ]
- Contact Type : Pin
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
- Mating Pin Diameter : 1.75 MM [.069 INCH ]
- PCB Contact Termination Area Plating Material : Tin
- PCB Contact Termination Area Plating Material Finish : Matte
- PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
Dimensions
- Connector Height : 11.79 MM [.464 INCH ]
- Connector Length : 12.7 MM [.5 INCH ]
- Connector Width : 12.7 MM [.5 INCH ]
- Row-to-Row Spacing : 4.98 MM [.196 INCH ]
Electrical Characteristics
- Operating Voltage (VAC) : 600
- Operating Voltage (VDC) : 600
Housing Features
- Centerline (Pitch) : 5 MM [.197 INCH ]
- Housing Material : PA 66
Industry Standards
- Agency/Standard : UL, VDE, CSA
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment : With
- Mating Alignment Type : Polarization
- Mating Retention : With
- PCB Mount Alignment : Without
- PCB Mount Retention : With
- PCB Mount Retention Type : Screw Mount
Operation/Application
- Circuit Application : Power & Signal
Packaging Features
- Packaging Quantity : 126
- Packaging Type : Box
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Wire-to-Board
- Header Type : Fully Shrouded
- PCB Connector Assembly Type : PCB Mount Header
- Sealable : No
Termination Features
- Round Termination Post & Tail Diameter : .99 MM [.039 INCH ]
- Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
- Operating Temperature Range : -55 - 130 DEGC [-67 - 266 DEGF ]
