Contact Features Contact Base Material : Copper Alloy Contact Length : 34.52 MM [1.359 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.27 - 2.54 Contact Retention Within Housing : With Contact Size : Size 20 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Length : 34.52 MM [1.359 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.27 - 2.54 Contact Retention Within Housing : With Contact Size : Size 20 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features Contact Base Material : Copper Alloy Contact Length : 34.52 MM [1.359 INCH ] Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICM) : 1.27 - 2.54 Contact Retention Within Housing : With Contact Size : Size 20 Contact Type : Pin
Identification Marking Contact Color Code : None
Mechanical Attachment Contact Retention Type Within Housing : Retention Clip
Operation/Applicatio
n Solder Process Feature : Solder Dipped
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features
Contact Base Material : Copper Alloy
Contact Length : 34.52 MM [1.359 INCH ]
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICM) : 1.27 - 2.54
Contact Retention Within Housing : With
Contact Size : Size 20
Contact Type : Pin
Identification Marking
Contact Color Code : None
Mechanical Attachment
Contact Retention Type Within Housing : Retention Clip
Operation/Application
Solder Process Feature : Solder Dipped
Packaging Features
Packaging Method : Tray
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Solder
