TE Connectivity Board-to-Board Headers & Receptacles 1-1761614-5

Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Dual Beam, Square, Single Beam Contact Type : Tab Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.04 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 15.95 MM  [.626835 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 20 MM , 30 MM , 26 MM  [1.181 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 25 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
  • Board-to-Board Headers & Receptacles - 1-1761614-5 - TE Connectivity
    TE Connectivity
  • Arrays, Edge Type, Mezzanine (Board to Board) - A108917-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Dual Beam, Square, Single Beam Contact Type : Tab Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.04 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 15.95 MM  [.626835 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 20 MM , 30 MM , 26 MM  [1.181 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 25 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
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Suppliers

Company
Product
Description
Supplier Links
Board-to-Board Headers & Receptacles - 1-1761614-5 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Board-to-Board Headers & Receptacles
1-1761614-5
Board-to-Board Headers & Receptacles 1-1761614-5
Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 200 Number of Rows : 18 PCB Mount Orientation : Vertical Stackable : Yes Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Layout : Matrix Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ] Contact Shape & Form : Dual Beam, Square, Single Beam Contact Type : Tab Mating Tab Thickness : .2 MM  [.008 INCH ] Mating Tab Width : 1 MM  [.04 INCH ] PCB Contact Termination Area Plating Material : Tin-Lead Dimensions Connector Height : 15.95 MM  [.626835 INCH ] PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ] Row-to-Row Spacing : 2 MM  [.0786 INCH ] Stack Height : 20 MM , 30 MM , 26 MM  [1.181 INCH ] Electrical Characteristics Dielectric Withstanding Voltage (Max) (VAC) : 500 Insulation Resistance (MEGO) : 18 Operating Voltage (VAC) : 48 Housing Features Centerline (Pitch) : 1.3 MM  [.051 INCH ] Housing Color : Natural Housing Material : Thermoplastic Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without Mating Retention : With PCB Mount Alignment : Without PCB Mount Retention : Without Operation/Applicatio n Assembly Process Feature : None Circuit Application : Power & Signal Packaging Features Packaging Method : Tray Packaging Quantity : 25 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Pin Header PCB Connector Assembly Type : PCB Mount Header Sealable : No Termination Features Termination Method to Printed Circuit Board : Surface Mount - Solder Ball Usage Conditions Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]

Configuration Features


  • Board-to-Board Configuration : Parallel
  • Number of Positions : 200
  • Number of Rows : 18
  • PCB Mount Orientation : Vertical
  • Stackable : Yes

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Layout : Matrix
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness : .76 MICM  [29.9212 MICIN ]
  • Contact Shape & Form : Dual Beam, Square, Single Beam
  • Contact Type : Tab
  • Mating Tab Thickness : .2 MM  [.008 INCH ]
  • Mating Tab Width : 1 MM  [.04 INCH ]
  • PCB Contact Termination Area Plating Material : Tin-Lead

Dimensions


  • Connector Height : 15.95 MM  [.626835 INCH ]
  • PCB Thickness (Recommended) : 1.57 MM  [.8 INCH ]
  • Row-to-Row Spacing : 2 MM  [.0786 INCH ]
  • Stack Height : 20 MM , 30 MM , 26 MM  [1.181 INCH ]

Electrical Characteristics


  • Dielectric Withstanding Voltage (Max) (VAC) : 500
  • Insulation Resistance (MEGO) : 18
  • Operating Voltage (VAC) : 48

Housing Features


  • Centerline (Pitch) : 1.3 MM  [.051 INCH ]
  • Housing Color : Natural
  • Housing Material : Thermoplastic

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Mating Alignment : Without
  • Mating Retention : With
  • PCB Mount Alignment : Without
  • PCB Mount Retention : Without

Operation/Application


  • Assembly Process Feature : None
  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Tray
  • Packaging Quantity : 25

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • Header Type : Pin Header
  • PCB Connector Assembly Type : PCB Mount Header
  • Sealable : No

Termination Features


  • Termination Method to Printed Circuit Board : Surface Mount - Solder Ball

Usage Conditions


  • Operating Temperature Range : 0 - 100 DEGC  [32 - 212 DEGF ]
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Thief River Falls, MN, United States
Arrays, Edge Type, Mezzanine (Board to Board)
A108917-ND
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Powell Electronics, Inc.
Swedesboro, NJ, United States
Board to Board & Mezzanine Connectors
1-1761614-5
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Acme Chip Technology Co., Limited
Shenzhen, China
Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
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Technical Specifications

  TE Connectivity DigiKey Powell Electronics, Inc. Acme Chip Technology Co., Limited
Product Category Electrical Connectors Board Mount Connectors Electrical Connectors Electrical Connectors
Product Number 1-1761614-5 A108917-ND 1-1761614-5 1-1761614-5
Product Name Board-to-Board Headers & Receptacles Arrays, Edge Type, Mezzanine (Board to Board) Board to Board & Mezzanine Connectors Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Connector Type Board to Board Connector Differential Pair Array, Male Board to Board Connector Rectangular Connectors, Heavy Duty
Termination Surface Mount - Solder Ball
Mounting Board Mount Surface Mount
Voltage Rating 48 volts
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