Body Features Ejector Type : Standard
Configuration Features Module Orientation : Vertical Number of Positions : 240
Contact Features Contact Current Rating (Max) (AMP) : .5
Dimensions Row-to-Row Spacing : 1.9 MM [.075 INCH ]
Housing Features Centerline (Pitch) : 2 MM [.07 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Through Hole - Solder Polarization : Left
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Box & Tray, Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Sealable : No
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Body Features Ejector Type : Standard
Configuration Features Module Orientation : Vertical Number of Positions : 240
Contact Features Contact Current Rating (Max) (AMP) : .5
Dimensions Row-to-Row Spacing : 1.9 MM [.075 INCH ]
Housing Features Centerline (Pitch) : 2 MM [.07 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Through Hole - Solder Polarization : Left
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Box & Tray, Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Sealable : No
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features Ejector Type : Standard
Configuration Features Module Orientation : Vertical Number of Positions : 240
Contact Features Contact Current Rating (Max) (AMP) : .5
Dimensions Row-to-Row Spacing : 1.9 MM [.075 INCH ]
Housing Features Centerline (Pitch) : 2 MM [.07 INCH ]
Mechanical Attachment Connector Mounting Type : Board Mount PCB Mounting Style : Through Hole - Solder Polarization : Left
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Box & Tray, Tray
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Sealable : No
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Body Features
Ejector Type : Standard
Configuration Features
Module Orientation : Vertical
Number of Positions : 240
Contact Features
Contact Current Rating (Max) (AMP) : .5
Dimensions
Row-to-Row Spacing : 1.9 MM [.075 INCH ]
Housing Features
Centerline (Pitch) : 2 MM [.07 INCH ]
Mechanical Attachment
Connector Mounting Type : Board Mount
PCB Mounting Style : Through Hole - Solder
Polarization : Left
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Box & Tray, Tray
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
DRAM Type : Double Data Rate (DDR) 3
Sealable : No
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
