TE Connectivity Mini DIMM Sockets 1-1735438-2

Description
Body Features Center Post Material : Liquid Crystal Polymer (LCP) Ejector Location : Both Ends Ejector Material : Liquid Crystal Polymer (LCP) Ejector Material Color : Natural Ejector Type : Standard Hold-Down Material : Copper Alloy Latch Color : Natural Latch Material : Liquid Crystal Polymer (LCP) Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation Retention Post Location : None Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Hold-Downs : 6 Number of Keys : 1 Number of Positions : 244 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 15 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash Socket Style : Mini DIMM Socket Type : Memory Card Dimensions Center Retention Hole Diameter : 2.5 MM  [.098 INCH ] Height Above PC Board : 9.79 MM  [.385 INCH ] Row-to-Row Spacing : 8.7 MM  [.343 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Hold-Down Plating Material : Tin Housing Color : Black Housing Material : LCP (Liquid Crystal Polymer) Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Hard Tray, Tray Packaging Quantity : 15 Product Type Features Center Post : With Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Profile : Standard Termination Features Insertion Style : Direct Insert Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
  • Mini DIMM Sockets - 1-1735438-2 - TE Connectivity
    TE Connectivity
  • Inline Module Sockets - A114813-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
Body Features Center Post Material : Liquid Crystal Polymer (LCP) Ejector Location : Both Ends Ejector Material : Liquid Crystal Polymer (LCP) Ejector Material Color : Natural Ejector Type : Standard Hold-Down Material : Copper Alloy Latch Color : Natural Latch Material : Liquid Crystal Polymer (LCP) Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation Retention Post Location : None Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Hold-Downs : 6 Number of Keys : 1 Number of Positions : 244 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 15 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash Socket Style : Mini DIMM Socket Type : Memory Card Dimensions Center Retention Hole Diameter : 2.5 MM  [.098 INCH ] Height Above PC Board : 9.79 MM  [.385 INCH ] Row-to-Row Spacing : 8.7 MM  [.343 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Hold-Down Plating Material : Tin Housing Color : Black Housing Material : LCP (Liquid Crystal Polymer) Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Hard Tray, Tray Packaging Quantity : 15 Product Type Features Center Post : With Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Profile : Standard Termination Features Insertion Style : Direct Insert Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Mini DIMM Sockets - 1-1735438-2 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Mini DIMM Sockets
1-1735438-2
Mini DIMM Sockets 1-1735438-2
Body Features Center Post Material : Liquid Crystal Polymer (LCP) Ejector Location : Both Ends Ejector Material : Liquid Crystal Polymer (LCP) Ejector Material Color : Natural Ejector Type : Standard Hold-Down Material : Copper Alloy Latch Color : Natural Latch Material : Liquid Crystal Polymer (LCP) Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation Retention Post Location : None Configuration Features Center Key : None Keying : Reverse Module Orientation : Right Angle Number of Hold-Downs : 6 Number of Keys : 1 Number of Positions : 244 Number of Rows : 2 Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Thickness (MICIN) : 15 Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash Socket Style : Mini DIMM Socket Type : Memory Card Dimensions Center Retention Hole Diameter : 2.5 MM  [.098 INCH ] Height Above PC Board : 9.79 MM  [.385 INCH ] Row-to-Row Spacing : 8.7 MM  [.343 INCH ] Electrical Characteristics DRAM Voltage (V) : 1.5 Housing Features Centerline (Pitch) : .6 MM  [.024 INCH ] Hold-Down Plating Material : Tin Housing Color : Black Housing Material : LCP (Liquid Crystal Polymer) Industry Standards UL Flammability Rating : UL 94V-0 Mechanical Attachment Connector Mounting Type : Board Mount Locating Posts : With PCB Mount Retention : With PCB Mount Retention Type : Solder Peg PCB Mounting Style : Surface Mount Operation/Applicatio n Circuit Application : Power & Signal Packaging Features Packaging Method : Hard Tray, Tray Packaging Quantity : 15 Product Type Features Center Post : With Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board DRAM Type : Double Data Rate (DDR) 3 Product Type : Socket Profile : Standard Termination Features Insertion Style : Direct Insert Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Center Post Material : Liquid Crystal Polymer (LCP)
  • Ejector Location : Both Ends
  • Ejector Material : Liquid Crystal Polymer (LCP)
  • Ejector Material Color : Natural
  • Ejector Type : Standard
  • Hold-Down Material : Copper Alloy
  • Latch Color : Natural
  • Latch Material : Liquid Crystal Polymer (LCP)
  • Module Key Type : Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation
  • Retention Post Location : None

Configuration Features


  • Center Key : None
  • Keying : Reverse
  • Module Orientation : Right Angle
  • Number of Hold-Downs : 6
  • Number of Keys : 1
  • Number of Positions : 244
  • Number of Rows : 2

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Current Rating (Max) (AMP) : 1
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Thickness (MICIN) : 15
  • Contact Underplating Material : Nickel
  • PCB Contact Termination Area Plating Material : Gold Flash
  • Socket Style : Mini DIMM
  • Socket Type : Memory Card

Dimensions


  • Center Retention Hole Diameter : 2.5 MM  [.098 INCH ]
  • Height Above PC Board : 9.79 MM  [.385 INCH ]
  • Row-to-Row Spacing : 8.7 MM  [.343 INCH ]

Electrical Characteristics


  • DRAM Voltage (V) : 1.5

Housing Features


  • Centerline (Pitch) : .6 MM  [.024 INCH ]
  • Hold-Down Plating Material : Tin
  • Housing Color : Black
  • Housing Material : LCP (Liquid Crystal Polymer)

Industry Standards


  • UL Flammability Rating : UL 94V-0

Mechanical Attachment


  • Connector Mounting Type : Board Mount
  • Locating Posts : With
  • PCB Mount Retention : With
  • PCB Mount Retention Type : Solder Peg
  • PCB Mounting Style : Surface Mount

Operation/Application


  • Circuit Application : Power & Signal

Packaging Features


  • Packaging Method : Hard Tray, Tray
  • Packaging Quantity : 15

Product Type Features


  • Center Post : With
  • Connector & Contact Terminates To : Printed Circuit Board
  • Connector System : Board-to-Board
  • DRAM Type : Double Data Rate (DDR) 3
  • Product Type : Socket
  • Profile : Standard

Termination Features


  • Insertion Style : Direct Insert

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Buy Now
Inline Module Sockets - A114813-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Inline Module Sockets
A114813-ND
Inline Module Sockets A114813-ND
244 Position MiniDIMM DDR3 SDRAM Socket Surface Mount, Right Angle

244 Position MiniDIMM DDR3 SDRAM Socket Surface Mount, Right Angle

Buy Now Datasheet

Technical Specifications

  TE Connectivity DigiKey
Product Category Electrical Connectors Board Mount Connectors
Product Number 1-1735438-2 A114813-ND
Product Name Mini DIMM Sockets Inline Module Sockets
Connector Type Board to Board Connector
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