TE Connectivity Headers & Wire Housings 1-171370-1

Description
2.3 DIA CLUSTER BLOCK HSG
Request a Quote
Description
2.3 DIA CLUSTER BLOCK HSG
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - 1-171370-1 - Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
1-171370-1
Headers & Wire Housings 1-171370-1
2.3 DIA CLUSTER BLOCK HSG

2.3 DIA CLUSTER BLOCK HSG

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number 1-171370-1
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

Backplane Conn, Header, 12S+2P; Product Range Amphenol Communications Solutions - 64AC9861 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
Mounting Through-Hole; Through Hole Right Angle
View Details
Peripheral Tri-Temp Test: Celsius Series -  - Molex Signal Tech Industrial Ltd.
Molex Signal Tech Industrial Ltd.
Specs
Product Type IC Socket
Socket Type Test
View Details
PCB Headers & Receptacles - 102589-5 - TE Connectivity
Specs
Product Type IC Headers
Mounting Board Mount
Voltage Rating 250 volts
View Details
2 suppliers
Mini SIM Card PCB Mount Socket - 80440GDH-081T-128L - Rego Electronics Inc.
Specs
Product Type IC Socket
Features Push-Push w/Switch
Number of Contacts 8
View Details