TDK Corporation Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R B82498F3820J1

Description
Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R
Description
Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R

Suppliers

Company
Product
Description
Supplier Links
Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R - 769-B82498F3820J1 - Utmel Electronic Limited
Hong Kong, China
Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R
769-B82498F3820J1
Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R 769-B82498F3820J1
Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R

Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R

Supplier's Site

Technical Specifications

  Utmel Electronic Limited
Product Category Inductors, Coils, and Chokes
Product Number 769-B82498F3820J1
Product Name Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R
Inductance Range 0.0820 microH
Rated DC Current 500 milliamps
Testing Frequency 150000 kHz
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