T-Global Technology Co., Ltd. Gap Filler, 3Mm Sheet; Insulator Body Material T Global L375-150-3.0A

Description
GAP FILLER, 3MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m. K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes
Datasheet
Description
GAP FILLER, 3MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m. K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Filler, 3Mm Sheet; Insulator Body Material T Global - 53M8234 - Newark, An Avnet Company
Chicago, IL, United States
Gap Filler, 3Mm Sheet; Insulator Body Material T Global
53M8234
Gap Filler, 3Mm Sheet; Insulator Body Material T Global 53M8234
GAP FILLER, 3MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m. K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes

GAP FILLER, 3MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 53M8234
Product Name Gap Filler, 3Mm Sheet; Insulator Body Material T Global
Thermal Conductivity 1.6 W/m-K (0.9245 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thin Flim, General Purpose with 0.05mm Glass Cloth Reinforcement - SARCON ® GTR - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0059 to 0.0118 inch (0.1500 to 0.3000 mm)
Industry Electronics; Semiconductors, IC's
View Details
Advanced Conductive Die Attach for Semiconductors - ATROX ® 558-2C31 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoset
Form / Shape Die Bonding Adhesives; Grease, Paste
Industry Electronics; Semiconductors, IC's
View Details
SY300 Series Aerogel Insulation Film - SY300 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Industry Electronics
Use Temperature -40 to 266 F (-40 to 130 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details