T-Global Technology Co., Ltd. Gap Filler, 2Mm Sheet; Insulator Body Material T Global L375-150-2.0A

Description
GAP FILLER, 2MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m. K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes
Datasheet
Description
GAP FILLER, 2MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m. K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Filler, 2Mm Sheet; Insulator Body Material T Global - 53M8233 - Newark, An Avnet Company
Chicago, IL, United States
Gap Filler, 2Mm Sheet; Insulator Body Material T Global
53M8233
Gap Filler, 2Mm Sheet; Insulator Body Material T Global 53M8233
GAP FILLER, 2MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m. K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes

GAP FILLER, 2MM SHEET; Insulator Body Material:Carbon; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:-; Thickness:2mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:L375 Series; SVHC:No SVHC RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 53M8233
Product Name Gap Filler, 2Mm Sheet; Insulator Body Material T Global
Thermal Conductivity 1.6 W/m-K (0.9245 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermally silicone pad for AI - SF1200 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 257 F (-50 to 125 C)
View Details
ATROX ® 590-4HT1 -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Form / Shape Die Bonding Adhesives
Composition Filled
Industry Electronics; Semiconductors, IC's
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details