T-Global Technology Co., Ltd. Gap Filler, 2Mm Sheet; Thermal Conductivity T Global L373S-150-2.0

Description
GAP FILLER, 2MM SHEET; Thermal Conductivity:1.4W/m. K; Conductive Material:-; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:150mm; Product Range:L373S Series; SVHC:No SVHC (15-Jan-2018); RoHS Compliant: Yes
Datasheet
Description
GAP FILLER, 2MM SHEET; Thermal Conductivity:1.4W/m. K; Conductive Material:-; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:150mm; Product Range:L373S Series; SVHC:No SVHC (15-Jan-2018); RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Filler, 2Mm Sheet; Thermal Conductivity T Global - 53M8230 - Newark, An Avnet Company
Chicago, IL, United States
Gap Filler, 2Mm Sheet; Thermal Conductivity T Global
53M8230
Gap Filler, 2Mm Sheet; Thermal Conductivity T Global 53M8230
GAP FILLER, 2MM SHEET; Thermal Conductivity:1.4W/m. K; Conductive Material:-; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:150mm; Product Range:L373S Series; SVHC:No SVHC (15-Jan-2018); RoHS Compliant: Yes

GAP FILLER, 2MM SHEET; Thermal Conductivity:1.4W/m.K; Conductive Material:-; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:150mm; Product Range:L373S Series; SVHC:No SVHC (15-Jan-2018); RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 53M8230
Product Name Gap Filler, 2Mm Sheet; Thermal Conductivity T Global
Thermal Conductivity 1.4 W/m-K (0.8089 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details