Material Zirconia, Silicon carbide (Sic), Tungsten carbide & SUS .Features and Benefits· Tungsten Steel is known for its exceptional hardness and resistance to wear and tear, making it ideal for high-precision applications like semiconductor packaging, where tools undergo constant mechanical stress and high temperatures during wire bonding.· This material can withstand the high forces, vibrations, and ultrasonic energy involved in the wire bonding process without significant wear, ensuring consistent performance over time.· Tungsten steel collets help in achieving tight tolerances, which is essential in semiconductor packaging, where the bonding wire must be placed accurately on micro-sized pads.· In wire bonding, especially ultrasonic bonding, reducing vibration in the bonding tool is critical to achieve precise bonding. Applications Used in Semiconductor die attach process, COB packaging, MEMS.
| Suntech Applied Materials (Hefei) Co.,Ltd | |
|---|---|
| Product Category | Collets |
| Product Name | Die Bonding Collets |
