There are now a large and increasing number of production advanced materials designed to solve the critical problems in packaging of microelectronics, diode lasers, LEDs, displays, photovoltaics, sensors and MEMS. This course will examine materials to help alleviate issues including heat dissipation, thermal stresses, warpage, alignment, weight, size, cost, and manufacturing yield. Decades-old traditional low-coefficient-of-t
hermal-expansion (CTE) materials like tungsten/copper, molybdenum/copper, copper-Invar-copper, "Kovar", etc., have thermal conductivities that are no better than that of aluminum. There are now many low-density, low-CTE advanced composite and monolithic materials with much higher thermal conductivities - some as high as 1700 W/m-K - resulting in a large, increasing number of production applications. Some are cheaper than traditional materials. Weight savings as high as 85% have been demonstrated.
There are now a large and increasing number of production advanced materials designed to solve the critical problems in packaging of microelectronics, diode lasers, LEDs, displays, photovoltaics, sensors and MEMS. This course will examine materials to help alleviate issues including heat dissipation, thermal stresses, warpage, alignment, weight, size, cost, and manufacturing yield. Decades-old traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, molybdenum/copper, copper-Invar-copper, "Kovar", etc., have thermal conductivities that are no better than that of aluminum. There are now many low-density, low-CTE advanced composite and monolithic materials with much higher thermal conductivities - some as high as 1700 W/m-K - resulting in a large, increasing number of production applications. Some are cheaper than traditional materials. Weight savings as high as 85% have been demonstrated.
