SPIE - Education How and Why: The big ideas in semiconductor lithography SC1173

Moore’s Law has been changing the world for over 50 years, and advances in lithography have been a (the) major factor in its success. This course will review several major conceptual and technical underpinnings of lithography for semiconductor manufacturing, providing a large, holistic view of where we are, how we got here, and where we are going next. Topics include Moore’s Law, resolution and depth of focus, the components of optical resolution, chemically amplified resists, lithography impacts on design, and next generation lithography. 1. Moore’s Law – History, components, meaning, Dennard scaling, impact on lithography 2. The focus-exposure matrix, depth of focus, and the Normalized Image Log-Slope (NILS) 3. Chemically amplified resists, acid and quencher diffusion, and isofocal bias 4. Imaging, resolution, and the change from three-beam to two-beam imaging 5. Design – WYSIWYG, design rules, litho-friendly design 6. The Future – what will be the next generation of lithography? How will it impact Moore’s Law?