OMEGA Engineering, Inc. Glue, Adhesives, Applicators OB-500 POWDER

Description
CEMENT POWDER, AIR SET, HIGH TEM
  • Glue, Adhesives, Applicators - 5880-OB-500POWDER-ND - DigiKey
    DigiKey
Request a Quote Datasheet
Description
CEMENT POWDER, AIR SET, HIGH TEM
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Glue, Adhesives, Applicators - 5880-OB-500POWDER-ND - DigiKey
DigiKey
Thief River Falls, MN, United States
Glue, Adhesives, Applicators
5880-OB-500POWDER-ND
Glue, Adhesives, Applicators 5880-OB-500POWDER-ND
CEMENT POWDER, AIR SET, HIGH TEM

CEMENT POWDER, AIR SET, HIGH TEM

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Industrial Adhesives
Product Number 5880-OB-500POWDER-ND
Product Name Glue, Adhesives, Applicators
Unlock Full Specs
to access all available technical data

Similar Products

Thermal pad for chipset - SF800 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal pad for chipset
SF800
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 302 F (-50 to 150 C)
View Details
Dymax Ultra-Red Fluorescing 3113-UR UV Curing Adhesive Clear 10 mL MR Syringe - 3113-UR 10ML MR SYRINGE - Ellsworth Adhesives
Dymax
Dymax Ultra-Red Fluorescing 3113-UR UV Curing Adhesive Clear 10 mL MR Syringe
3113-UR 10ML MR SYRINGE
Specs
Cure / Technology Single Component
Substrate Compatibility Plastic
Viscosity 150 cP
View Details
1-Part, General Purpose, RTV Silicone Adhesive Sealant - AS5702 - CHT USA Inc.
CHT USA Inc.
1-Part, General Purpose, RTV Silicone Adhesive Sealant
AS5702
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Features Sealant
View Details
Fiber Adhesive - - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Fiber Adhesive
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details