OMEGA Engineering, Inc. Epoxy Adhesive, Packet, 0.5Oz; Dispensing Method Omega OB-101-1/2

Description
EPOXY ADHESIVE, PACKET, 0.5OZ; Dispensing Method:Packet; Volume:-; Weight:0.5oz; Product Range:OMEGABOND Series; Adhesive Type:Epoxy RoHS Compliant: Yes
  • Epoxy Adhesive, Packet, 0.5Oz; Dispensing Method Omega - 71AC1683 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
EPOXY ADHESIVE, PACKET, 0.5OZ; Dispensing Method:Packet; Volume:-; Weight:0.5oz; Product Range:OMEGABOND Series; Adhesive Type:Epoxy RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Epoxy Adhesive, Packet, 0.5Oz; Dispensing Method Omega - 71AC1683 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Epoxy Adhesive, Packet, 0.5Oz; Dispensing Method Omega
71AC1683
Epoxy Adhesive, Packet, 0.5Oz; Dispensing Method Omega 71AC1683
EPOXY ADHESIVE, PACKET, 0.5OZ; Dispensing Method:Packet; Volume:-; Weight:0.5oz; Product Range:OMEGABOND Series; Adhesive Type:Epoxy RoHS Compliant: Yes

EPOXY ADHESIVE, PACKET, 0.5OZ; Dispensing Method:Packet; Volume:-; Weight:0.5oz; Product Range:OMEGABOND Series; Adhesive Type:Epoxy RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 71AC1683
Product Name Epoxy Adhesive, Packet, 0.5Oz; Dispensing Method Omega
Unlock Full Specs
to access all available technical data

Similar Products

Advanced Conductive Die Attach for Semiconductors - ATROX ® 558-2C31 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Advanced Conductive Die Attach for Semiconductors
ATROX ® 558-2C31
Specs
Cure / Technology Thermoset
Form / Shape Die Bonding Adhesives; Grease, Paste
Industry Electronics; Semiconductors, IC's
View Details
High performance silicone thermal conductive pad - SF600 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High performance silicone thermal conductive pad
SF600
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
CHT USA Inc.
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed
AS1707
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details