Low thermal resistance: designed for < 1 gpm coolant flow.
Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications.
Patented and patent-pending designs allows for efficient heat transfer at low cost.
Uniform thermal resistance over entire surface – no hot spots.
Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by one-half for two-sided operation.
Interior may be Teflon®-or nickel coated.
| Solid State Cooling Systems | |
|---|---|
| Product Category | Heat Exchangers |
| Product Name | Low Flow LC Cold Plate |
| Application / Industry | Electronic or Power Supply Cooling |
| Technology | Plate |
| Type | Cold |
| Primary Material | Aluminum |
