Solid State Cooling Systems LCW Cold Plate

Description
Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patent and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface ­– no hot spots. Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by one-half for two-sided operation. Interior may be Teflon®-or nickel coated.
Datasheet
Description
Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patent and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface ­– no hot spots. Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by one-half for two-sided operation. Interior may be Teflon®-or nickel coated.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
LCW Cold Plate -  - Solid State Cooling Systems
Wappingers Falls, NY, USA
LCW Cold Plate
LCW Cold Plate
Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patent and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface ­– no hot spots. Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by one-half for two-sided operation. Interior may be Teflon®-or nickel coated.

Low thermal resistance: low-pressure drop, all at a low price!
Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications.
Patent and patent-pending design allows for efficient heat transfer at a low cost.
Uniform thermal resistance over entire surface ­– no hot spots.
Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by one-half for two-sided operation.
Interior may be Teflon®-or nickel coated.

Supplier's Site Datasheet

Technical Specifications

  Solid State Cooling Systems
Product Category Heat Exchangers
Product Name LCW Cold Plate
Application / Industry Electronic or Power Supply Cooling
Technology Plate
Type Cold
Primary Material Aluminum
Unlock Full Specs
to access all available technical data

Similar Products

Plate Heat Exchangers - 1694397 - RS Components, Ltd.
Specs
Application / Industry HVAC
Technology Plate
Primary Material Copper or Copper Alloy
View Details
Fusion Bond Stainless -  - Hexnovas Heat Exchanger Technology Co., Ltd
Hexnovas Heat Exchanger Technology Co., Ltd
Specs
Application / Industry Chemical Processing; Refrigeration
Technology Plate
Working Pressure 218 to 653 psi (153 to 459 m H2O)
View Details
AdvancAir -  - Air Innovations LLC
Air Innovations LLC
Specs
Application / Industry Aerospace / Aviation; Chemical Processing; Food or Beverage Processing; HVAC; Marine; Oil Heating / Cooling; Custom
Technology Air-Cooled; Water-Cooled
Temperature Range 0 to 100 F (-18 to 38 C)
View Details
Gasketed Plate Heat Exchanger - SPGC, SPGL, SPGLD & SPGX - jbj Techniques Limited
Specs
Technology Plate
Type Gasket
Working Pressure 363 psi (255 m H2O)
View Details