Solid State Cooling Systems High Flow HF Cold Plate

Low thermal resistance: very low pressure drop, all at a low price! Ideal for use with IGBT modules, power semiconductors, thermoelectric and other direct cooling applications. Patented and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface ­– no hot spots. Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by approximately one-half for two-sided operation. Drill and tap to 6 mm depth on both sides for easy parts mounting Interior may be Teflon®-or nickel coated.