Low thermal resistance: very low pressure drop, all at a low price!
Ideal for use with IGBT modules, power semiconductors, thermoelectric and other direct cooling applications.
Patented and patent-pending design allows for efficient heat transfer at a low cost.
Uniform thermal resistance over entire surface – no hot spots.
Double-sided: both sides have the same heat transfer properties. Thermal resistance graphs are shown for one side only: all values are reduced by approximately one-half for two-sided operation.
Drill and tap to 6 mm depth on both sides for easy parts mounting
Interior may be Teflon®-or nickel coated.
| Solid State Cooling Systems | |
|---|---|
| Product Category | Heat Exchangers |
| Product Name | High Flow HF Cold Plate |
| Application / Industry | Electronic or Power Supply Cooling |
| Technology | Plate |
| Type | Cold |
