Smiths Interconnect, a Molex company Kelvin Probes Solution: Kelvin Probes for Peripheral and Array Devices

Features & Benefits Technical Features Device contact pitch: 0.35mm pitch and above Operating Temperature Range: -55°C to 120°C Device packages: BGA, WLCSP, QFN Pin-to-pin tip distance is 0.07mm-0.14mm, depending on the pin used Insertions: >500,000 Innovative beveled offset tip allows for tighter centers, down to 0.25mm on the device pad Benefits Suited for 0.35mm pitch and above applications Four-terminal measurement for low resistance power and analog test Ease of maintenance Excellent signal integrity Self-cleaning