Smiths Interconnect, a Molex company HDLP: Lightweight High Density PCB

Description
High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance. Features & Benefits Up to 2000 mating cycles Polarized and scoop proof insulator Low component count & low insertion force IP67 sealing when mated Featuring Hypertac® hyperboloid contact technology
  • HDLP: Lightweight High Density PCB - Smiths Interconnect, a Molex company
    Smiths Interconnect, a Molex company
Request a Quote Datasheet
Description
High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance. Features & Benefits Up to 2000 mating cycles Polarized and scoop proof insulator Low component count & low insertion force IP67 sealing when mated Featuring Hypertac® hyperboloid contact technology
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
HDLP: Lightweight High Density PCB - - Smiths Interconnect, a Molex company
Smiths Interconnect, a Molex company
London, United Kingdom
HDLP: Lightweight High Density PCB
HDLP: Lightweight High Density PCB
High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance. Features & Benefits Up to 2000 mating cycles Polarized and scoop proof insulator Low component count & low insertion force IP67 sealing when mated Featuring Hypertac® hyperboloid contact technology

High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.

Features & Benefits

  • Up to 2000 mating cycles
  • Polarized and scoop proof insulator
  • Low component count & low insertion force
  • IP67 sealing when mated
  • Featuring Hypertac® hyperboloid contact technology
Supplier's Site Datasheet

Technical Specifications

  Smiths Interconnect, a Molex company
Product Category Board Mount Connectors
Product Name HDLP: Lightweight High Density PCB
Category Board to Board Connector; Military Connector
Unlock Full Specs
to access all available technical data