Silicon Motion, Inc. Memory SM671PXB-AD

Description
FERRI-UFS BGA 153-B EMMC 3D TLC
Description
FERRI-UFS BGA 153-B EMMC 3D TLC
Datasheet
Datasheet Summary
Powered by GS/AI

The SM671PXB-AD is a UFS memory product from Lingto Electronic Limited, designed for industrial and automotive applications. It complies with the UFS 3.1 standard and features a high-performance flash controller integrated with NAND flash memory. This product supports capacities ranging from 64GB to 512GB and operates within a temperature range suitable for commercial, industrial, and automotive environments, specifically from -40¬8C to +105¬8C. Key features include advanced error correction through a hardware LDPC engine, dynamic power management for efficiency, and robust data protection mechanisms that safeguard against power instability. The memory also supports advanced wear leveling to enhance reliability and lifespan. The package is a 153-ball BGA, measuring 11.5 x 13 x 1.2 mm, and it is compliant with RoHS and halogen-free standards. This product is suitable for a variety of applications, including in-vehicle infotainment systems, medical devices, and factory automation.

Datasheet Summary
Powered by GS/AI

The SM671PXB-AD is a UFS memory product from Lingto Electronic Limited, designed for industrial and automotive applications. It complies with the UFS 3.1 standard and features a high-performance flash controller integrated with NAND flash memory. This product supports capacities ranging from 64GB to 512GB and operates within a temperature range suitable for commercial, industrial, and automotive environments, specifically from -40¬8C to +105¬8C. Key features include advanced error correction through a hardware LDPC engine, dynamic power management for efficiency, and robust data protection mechanisms that safeguard against power instability. The memory also supports advanced wear leveling to enhance reliability and lifespan. The package is a 153-ball BGA, measuring 11.5 x 13 x 1.2 mm, and it is compliant with RoHS and halogen-free standards. This product is suitable for a variety of applications, including in-vehicle infotainment systems, medical devices, and factory automation.

Suppliers

Company
Product
Description
Supplier Links
FERRI-UFS BGA 153-B EMMC 3D TLC

FERRI-UFS BGA 153-B EMMC 3D TLC

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - Memory - SM671PXB-AD - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
SM671PXB-AD
Integrated Circuits (ICs) - Memory - Memory SM671PXB-AD
FERRI-UFS BGA 153-B EMMC 3D TLC

FERRI-UFS BGA 153-B EMMC 3D TLC

Supplier's Site
Memory - SM671PXB-AD - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

Buy Now Datasheet

Technical Specifications

  Lingto Electronic Limited Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number SM671PXB-AD SM671PXB-AD SM671PXB-AD
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 170-0157-000 D - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
Memory - MYXxxSMS04GP32xxx-45/x - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category MRAM; STT-MRAM
Access Time 45 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 71124S15YG - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category SRAM; SRAM Chip
Access Time 15 ns
Density 1000 kbits
View Details
Flash Memory - 1882878P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Package Type VFBGA
Pins 63
View Details