The SM671PAE-BFST is a UFS memory product from Quarktwin Technology Ltd., designed for industrial and automotive applications. It adheres to the UFS 3.1 standard and features a high-performance flash controller combined with standard NAND flash memory. This memory solution supports capacities ranging from 64GB to 512GB and operates within a temperature range of -40¬8C to +105¬8C, making it suitable for a variety of demanding environments. Key features include advanced error correction with a hardware LDPC engine, dynamic power management for energy efficiency, and robust data protection mechanisms to prevent data corruption during power loss. The product also supports advanced wear leveling to enhance reliability and lifespan. Its compact 153-ball BGA package measures 11.5 x 13 x 1.2 mm, facilitating easy integration into various designs. The SM671PAE-BFST is compliant with automotive AEC-Q100 requirements and is RoHS compliant, ensuring it meets environmental standards. This memory solution is particularly well-suited for applications such as in-vehicle infotainment systems, medical devices, and industrial handheld devices, providing engineers with a reliable and efficient storage option for their projects.
IC FLASH 2TBIT UFS3.1 153BGA
Ferri-UFS BGA 153-b eMMC 3D TLC
FLASH - NAND (TLC) Memory IC 2Tbit UFS2.1 153-BGA (11.5x13)
| DigiKey | Acme Chip Technology Co., Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 1984-SM671PAE-BFST-ND | SM671PAE-BFST | SM671PAE-BFST |
| Product Name | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | Flash | Flash; FLASH | Flash; FLASH |