Silicon Motion, Inc. Integrated Circuits (ICs) - Memory - Memory SM671PAE-BFST

Description
Ferri-UFS BGA 153-b eMMC 3D TLC
Description
Ferri-UFS BGA 153-b eMMC 3D TLC
Datasheet
Datasheet Summary
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The SM671PAE-BFST is a UFS memory product from Quarktwin Technology Ltd., designed for industrial and automotive applications. It adheres to the UFS 3.1 standard and features a high-performance flash controller combined with standard NAND flash memory. This memory solution supports capacities ranging from 64GB to 512GB and operates within a temperature range of -40¬8C to +105¬8C, making it suitable for a variety of demanding environments. Key features include advanced error correction with a hardware LDPC engine, dynamic power management for energy efficiency, and robust data protection mechanisms to prevent data corruption during power loss. The product also supports advanced wear leveling to enhance reliability and lifespan. Its compact 153-ball BGA package measures 11.5 x 13 x 1.2 mm, facilitating easy integration into various designs. The SM671PAE-BFST is compliant with automotive AEC-Q100 requirements and is RoHS compliant, ensuring it meets environmental standards. This memory solution is particularly well-suited for applications such as in-vehicle infotainment systems, medical devices, and industrial handheld devices, providing engineers with a reliable and efficient storage option for their projects.

Datasheet Summary
Powered by GS/AI

The SM671PAE-BFST is a UFS memory product from Quarktwin Technology Ltd., designed for industrial and automotive applications. It adheres to the UFS 3.1 standard and features a high-performance flash controller combined with standard NAND flash memory. This memory solution supports capacities ranging from 64GB to 512GB and operates within a temperature range of -40¬8C to +105¬8C, making it suitable for a variety of demanding environments. Key features include advanced error correction with a hardware LDPC engine, dynamic power management for energy efficiency, and robust data protection mechanisms to prevent data corruption during power loss. The product also supports advanced wear leveling to enhance reliability and lifespan. Its compact 153-ball BGA package measures 11.5 x 13 x 1.2 mm, facilitating easy integration into various designs. The SM671PAE-BFST is compliant with automotive AEC-Q100 requirements and is RoHS compliant, ensuring it meets environmental standards. This memory solution is particularly well-suited for applications such as in-vehicle infotainment systems, medical devices, and industrial handheld devices, providing engineers with a reliable and efficient storage option for their projects.

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Memory - Memory - SM671PAE-BFST - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
SM671PAE-BFST
Integrated Circuits (ICs) - Memory - Memory SM671PAE-BFST
Ferri-UFS BGA 153-b eMMC 3D TLC

Ferri-UFS BGA 153-b eMMC 3D TLC

Supplier's Site
Memory - SM671PAE-BFST - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FLASH - NAND (TLC) Memory IC 2Tbit UFS2.1 153-BGA (11.5x13)

FLASH - NAND (TLC) Memory IC 2Tbit UFS2.1 153-BGA (11.5x13)

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Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number SM671PAE-BFST SM671PAE-BFST
Product Name Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category Flash; FLASH Flash; FLASH
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