Silicon Motion, Inc. Memory SM662PXE BESS

Description
FERRI EMMC 80GB 3D TLC BICS4 3D
Datasheet
Description
FERRI EMMC 80GB 3D TLC BICS4 3D
Datasheet

Suppliers

Company
Product
Description
Supplier Links
FERRI EMMC 80GB 3D TLC BICS4 3D

FERRI EMMC 80GB 3D TLC BICS4 3D

Supplier's Site Datasheet
Memory - SM662PXE BESS - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FLASH - NAND (TLC) Memory IC eMMC 100-BGA (14x18)

FLASH - NAND (TLC) Memory IC eMMC 100-BGA (14x18)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - SM662PXE BESS - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
SM662PXE BESS
Integrated Circuits (ICs) - Memory - Memory SM662PXE BESS
IC FLASH EMMC 100BGA

IC FLASH EMMC 100BGA

Supplier's Site

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number SM662PXE BESS SM662PXE BESS SM662PXE BESS
Product Name Memory Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category Flash; Flash Flash; FLASH Flash; Non-Volatile
Unlock Full Specs
to access all available technical data

Similar Products

SN74ACT2229 256 x 1 x 2 dual independent synchronous FIFO memories - SN74ACT2229DWR - Texas Instruments
Specs
Memory Category FIFO
Package Type SOIC
View Details
5 suppliers
Logic - FIFOs Memory - 67413J - Lingto Electronic Limited
Rochester Electronics
Specs
Data Rate 25 MHz
Operating Current 240 mA
View Details
104MHZ Memory IC and Storage Component - 774-S25FL032P0XMFV011 - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category Flash; Non-Volatile
Cycle Time 5000 to 3.00E6 ns
Operating Temperature -40 to 105 C (-40 to 221 F)
View Details
Memory - SMJ44400 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DRAM; DRAM Chip
Access Time 80 to 120 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details