Silicon Motion, Inc. Memory SM662PEE-BD

Description
FERRI-EMMC BGA 153-B EMMC 3D TLC
Datasheet
Description
FERRI-EMMC BGA 153-B EMMC 3D TLC
Datasheet

Suppliers

Company
Product
Description
Supplier Links
FERRI-EMMC BGA 153-B EMMC 3D TLC

FERRI-EMMC BGA 153-B EMMC 3D TLC

Supplier's Site Datasheet
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
SM662PEE-BD
Integrated Circuits (ICs) - Memory - Memory SM662PEE-BD
FERRI-EMMC BGA 153-B EMMC 3D TLC

FERRI-EMMC BGA 153-B EMMC 3D TLC

Supplier's Site
Memory - SM662PEE-BD - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

Buy Now Datasheet

Technical Specifications

  Lingto Electronic Limited Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number SM662PEE-BD SM662PEE-BD SM662PEE-BD
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 27S13A/BEA - Quarktwin Technology Ltd.
Rochester Electronics
Specs
Memory Category PROM; PROM
Access Time 40 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 520966230646 - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
Memory - AS4SD2M32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SDRAM; DRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 16000 kbits
View Details