FERRI-EMMC BGA 153-B EMMC 3D TLC Product overview: SM662PEB-BD from Silicon Motion is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include BGA. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, BGA, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-SM662PEB-BD can be used for catalog matching and distributor lookup.
Win Source Part Number: 1254194-SM662PEB-BD
Category: Integrated Circuits (ICs)>Memory
Package: Tray
Standard Package: 1
ECCN: 3A991B1A
Fake Threat In the Open Market: 65 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0071
Mfr: Silicon Motion, Inc.
Base Product Number: SM662
FERRI-EMMC BGA 153-B EMMC 3D TLC
FERRI-EMMC BGA 153-B EMMC 3D TLC
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | Lingto Electronic Limited | Quarktwin Technology Ltd. | Acme Chip Technology Co., Limited | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-SM662PEB-BD | 1254194-SM662PEB-BD | SM662PEB-BD | SM662PEB-BD | SM662PEB-BD |
| Product Name | BGA Memory IC and Storage Component | Integrated Circuits (ICs) - Memory | Memory | Memory | Integrated Circuits (ICs) - Memory - Memory |
| Operating Temperature | -40 C (-40 F) |
