Suppliers

Company

Product

Description

Supplier Links

Sheung Wan, Hong Kong

Gate Drivers
Si823H3CB-IM1

Gate Drivers Si823H3CB-IM1

Gate Drivers

Buy Now

Technical Specifications

Unlock Full Specs

to access all available technical data

Micross Components, Inc.

Rochester Electronics

Specs

Package Type DIP; CDIP

Packing Method Tube; Tube; Other

Texas Instruments

Specs

Driver Type High-side

Number of Outputs 4; 4

Output Configuration Inverting

2 suppliers

Nexperia B.V.

Specs

Operating Temperature -55 to 125 C (-67 to 257 F)

Package Type SOIC; "14-SOIC (0.154"", 3.90mm Width)"

Packing Method Tape Reel