Sheldahl Flexible Technologies - a Flex company Busbar Insulation Tape BusBond T9029

Description
Low-Flow Flame Retardant Adhesive on PEN Film Description T9029 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with PEN film and are designed for laminated busbar requiring a formable, higher temperature, hydrolysis resistant dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T9029 is RoHS compliant and registered UL 94 VTM-0 (E39696). Unique temperature resistant low flow adhesive makes T9029 ideal for use in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and standard conductor materials. Low variation in adhesive thickness (± 0.1 mil) simplifies production. Reduced production time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C. T9029, made with a biaxially oriented polyethylene naphthalate (PEN) film is a high temperature, low moisture absorption insulation solution.
Datasheet
Description
Low-Flow Flame Retardant Adhesive on PEN Film Description T9029 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with PEN film and are designed for laminated busbar requiring a formable, higher temperature, hydrolysis resistant dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T9029 is RoHS compliant and registered UL 94 VTM-0 (E39696). Unique temperature resistant low flow adhesive makes T9029 ideal for use in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and standard conductor materials. Low variation in adhesive thickness (± 0.1 mil) simplifies production. Reduced production time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C. T9029, made with a biaxially oriented polyethylene naphthalate (PEN) film is a high temperature, low moisture absorption insulation solution.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Busbar Insulation Tape - BusBond T9029 - Sheldahl Flexible Technologies - a Flex company
Northfield, MN, United States
Busbar Insulation Tape
BusBond T9029
Busbar Insulation Tape BusBond T9029
Low-Flow Flame Retardant Adhesive on PEN Film Description T9029 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with PEN film and are designed for laminated busbar requiring a formable, higher temperature, hydrolysis resistant dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T9029 is RoHS compliant and registered UL 94 VTM-0 (E39696). Unique temperature resistant low flow adhesive makes T9029 ideal for use in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and standard conductor materials. Low variation in adhesive thickness (± 0.1 mil) simplifies production. Reduced production time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C. T9029, made with a biaxially oriented polyethylene naphthalate (PEN) film is a high temperature, low moisture absorption insulation solution.

Low-Flow Flame Retardant Adhesive on PEN Film

Description

T9029 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with PEN film and are designed for laminated busbar requiring a formable, higher temperature, hydrolysis resistant dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products.

Features

  • T9029 is RoHS compliant and registered UL 94 VTM-0 (E39696).
  • Unique temperature resistant low flow adhesive makes T9029 ideal for use in laminated busbars requiring more than one lamination process.
  • High bond strength provides superior adhesion to copper, aluminum, and standard conductor materials.
  • Low variation in adhesive thickness (± 0.1 mil) simplifies production.
  • Reduced production time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change.
  • Finished products can achieve a UL minimum continuous use temperature rating of 125°C.
  • T9029, made with a biaxially oriented polyethylene naphthalate (PEN) film is a high temperature, low moisture absorption insulation solution.
Supplier's Site Datasheet

Technical Specifications

  Sheldahl Flexible Technologies - a Flex company
Product Category Adhesive Tapes
Product Number BusBond T9029
Product Name Busbar Insulation Tape
Type Electronics, Printed Circuit Boards or Semiconductors; Adhesive Tape; Industrial Tape; Cable and Electrical Tape
Features Abrasion / Scratch Resistant; Dielectric / Insulating; Thermally Insulating; UV or Weather Resistant; Flame Retardant
Backing Plastic / Polymer; PEN Film
Adhesive Single; Low Flow Flame Retardant Adhesive
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