Sheldahl Flexible Technologies - a Flex company Busbar Insulation Tape BusBond T1779

Description
Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T1779 is RoHS compliant and registered UL 94 V-0 (E39696). Unique temperature resistant low flow adhesive makes T1779 ideal for uses in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and most plated metals. Low variation in adhesive thickness (± 0.1 mil). Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C.
  • Busbar Insulation Tape - BusBond T1779 - Sheldahl Flexible Technologies - a Flex company
    Sheldahl Flexible Technologies - a Flex company
  • Busbar Insulation Tape - BusBond T1779 - Sheldahl Flexible Technologies - a Flex company
    Sheldahl Flexible Technologies - a Flex company
Datasheet
Description
Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T1779 is RoHS compliant and registered UL 94 V-0 (E39696). Unique temperature resistant low flow adhesive makes T1779 ideal for uses in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and most plated metals. Low variation in adhesive thickness (± 0.1 mil). Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Busbar Insulation Tape - BusBond T1779 - Sheldahl Flexible Technologies - a Flex company
Sheldahl Flexible Technologies - a Flex company
Northfield, MN, United States
Busbar Insulation Tape
BusBond T1779
Busbar Insulation Tape BusBond T1779
Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T1779 is RoHS compliant and registered UL 94 V-0 (E39696). Unique temperature resistant low flow adhesive makes T1779 ideal for uses in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and most plated metals. Low variation in adhesive thickness (± 0.1 mil). Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C.

Low-Flow Flame Retardant Adhesive on Polyimide Film

Description

T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products.

Features

  • T1779 is RoHS compliant and registered UL 94 V-0 (E39696).
  • Unique temperature resistant low flow adhesive makes T1779 ideal for uses in laminated busbars requiring more than one lamination process.
  • High bond strength provides superior adhesion to copper, aluminum, and most plated metals.
  • Low variation in adhesive thickness (± 0.1 mil).
  • Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change.
  • Finished products can achieve a UL minimum continuous use temperature rating of 125°C.
Supplier's Site Datasheet
Busbar Insulation Tape - BusBond T1779 - Sheldahl Flexible Technologies - a Flex company
Sheldahl Flexible Technologies - a Flex company
Northfield, MN, United States
Busbar Insulation Tape
BusBond T1779
Busbar Insulation Tape BusBond T1779
Low-Flow Flame Retardant Adhesive on Polyimide Film Description T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products. Features T1779 is RoHS compliant and registered UL 94 V-0 (E39696). Unique temperature resistant low flow adhesive makes T1779 ideal for uses in laminated busbars requiring more than one lamination process. High bond strength provides superior adhesion to copper, aluminum, and most plated metals. Low variation in adhesive thickness (± 0.1 mil). Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change. Finished products can achieve a UL minimum continuous use temperature rating of 125°C.

Low-Flow Flame Retardant Adhesive on Polyimide Film

Description

T1779 Bus Bond® insulations combine our proprietary low flow flame retardant adhesive with polyimide film and are designed for laminated busbar applications requiring a formable, higher temperature dielectric material. The materials high temperature tolerance provides end-users with solutions that are unattainable with other products.

Features

  • T1779 is RoHS compliant and registered UL 94 V-0 (E39696).
  • Unique temperature resistant low flow adhesive makes T1779 ideal for uses in laminated busbars requiring more than one lamination process.
  • High bond strength provides superior adhesion to copper, aluminum, and most plated metals.
  • Low variation in adhesive thickness (± 0.1 mil).
  • Reduced process time and wide lamination window cuts costs, prevents copper oxidation, and eliminates a major cause of dimensional change.
  • Finished products can achieve a UL minimum continuous use temperature rating of 125°C.
Supplier's Site Datasheet

Technical Specifications

  Sheldahl Flexible Technologies - a Flex company Sheldahl Flexible Technologies - a Flex company
Product Category Adhesive Tapes Adhesive Tapes
Product Number BusBond T1779 BusBond T1779
Product Name Busbar Insulation Tape Busbar Insulation Tape
Type Electronics, Printed Circuit Boards or Semiconductors; Double Coated and Transfer Tape; Adhesive Tape; Industrial Tape; Cable and Electrical Tape Electronics, Printed Circuit Boards or Semiconductors; Adhesive Tape; Industrial Tape; Cable and Electrical Tape
Features Abrasion / Scratch Resistant; Dielectric / Insulating; Thermally Insulating; UV or Weather Resistant; Flame Retardant Abrasion / Scratch Resistant; Dielectric / Insulating; Thermally Insulating; UV or Weather Resistant; Flame Retardant
Backing Polyimide (e.g., Kapton®); Plastic / Polymer Polyimide (e.g., Kapton®); Plastic / Polymer
Adhesive Double- Sided; Low Flow Flame Retardant Adhesive Single; Low Flow Flame Retardant Adhesive
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