Crydom Corporation Thermal Pad, 55.9 X 43.2 X 0.127 Mm; Thickness Sensata/crydom HSP-2

Description
THERMAL PAD, 55.9 X 43.2 X 0.127 MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100ohm-c m; External Length:55.9mm; External Width:43.2mm; Product Range:HSP Series RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD, 55.9 X 43.2 X 0.127 MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100ohm-c m; External Length:55.9mm; External Width:43.2mm; Product Range:HSP Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 55.9 X 43.2 X 0.127 Mm; Thickness Sensata/crydom - 79T5853 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 55.9 X 43.2 X 0.127 Mm; Thickness Sensata/crydom
79T5853
Thermal Pad, 55.9 X 43.2 X 0.127 Mm; Thickness Sensata/crydom 79T5853
THERMAL PAD, 55.9 X 43.2 X 0.127 MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100ohm-c m; External Length:55.9mm; External Width:43.2mm; Product Range:HSP Series RoHS Compliant: Yes

THERMAL PAD, 55.9 X 43.2 X 0.127 MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100ohm-cm; External Length:55.9mm; External Width:43.2mm; Product Range:HSP Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 79T5853
Product Name Thermal Pad, 55.9 X 43.2 X 0.127 Mm; Thickness Sensata/crydom
Thermal Conductivity 2 W/m-K (1.16 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Carbon Fiber Thermal Interface Material for LCD and Plasma TVs - CSF15 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details