Samtec Inc. Headers & Wire Housings TW-32-03-L-D-200-SM-A

Description
Flexible Micro Board Stacking Header, 0.
  • Headers & Wire Housings - TW-32-03-L-D-200-SM-A - Powell Electronics, Inc.
    Powell Electronics, Inc.
Request a Quote
Description
Flexible Micro Board Stacking Header, 0.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Headers & Wire Housings - TW-32-03-L-D-200-SM-A - Powell Electronics, Inc.
Powell Electronics, Inc.
Swedesboro, NJ, United States
Headers & Wire Housings
TW-32-03-L-D-200-SM-A
Headers & Wire Housings TW-32-03-L-D-200-SM-A
Flexible Micro Board Stacking Header, 0.

Flexible Micro Board Stacking Header, 0.

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number TW-32-03-L-D-200-SM-A
Product Name Headers & Wire Housings
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Related Documents

Similar Products

K Series H-Pin® Socket - - Smiths Interconnect, a Molex company
Smiths Interconnect, a Molex company
K Series H-Pin® Socket
Specs
Product Type IC Socket
Operating Temperature 200 C (392 F)
View Details
Backplane Conn, Header, 24S+4P; Product Range Amphenol Communications Solutions - 62K6096 - Newark, An Avnet Company
Amphenol Communications Solutions
Backplane Conn, Header, 24S+4P; Product Range Amphenol Communications Solutions
51720-10202402AALF
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
Mounting Through-Hole; Through Hole Right Angle
View Details
775E Series CSP/FBGA Devices - - Sensata Technologies
Sensata Technologies
775E Series CSP/FBGA Devices
Specs
Product Type IC Socket
Contact Resistance 300 milliohms
Operating Temperature 150 C (302 F)
View Details
Headers & Wire Housings - G125-FV10605L0R - Powell Electronics, Inc.
Harwin Plc
Headers & Wire Housings
G125-FV10605L0R
Specs
Product Type IC Headers
Mounting Through-Hole
View Details