Samtec Inc. Header, 2.54Mm, Through Hole Vertical, 13 Position; Connector Systems Samtec TSW-113-13-G-S

Description

HEADER, 2.54MM, THROUGH HOLE VERTICAL, 13 POSITION; Connector Systems:Board-to-Boa rd; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:13Contacts; Contact Termination Type:Through Hole; Product Range:TSW Series RoHS Compliant: Yes

Newark, An Avnet Company

Datasheet

Description

Datasheet

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Header, 2.54Mm, Through Hole Vertical, 13 Position; Connector Systems Samtec
86P7437

Header, 2.54Mm, Through Hole Vertical, 13 Position; Connector Systems Samtec 86P7437

Supplier's Site

Datasheet

Acme Chip Technology Co., Limited

Shenzhen, China

Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins
TSW-113-13-G-S

Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins TSW-113-13-G-S

CONN HDR .100" 13POS

Supplier's Site

Technical Specifications

	Newark, An Avnet Company	Acme Chip Technology Co., Limited
Product Category	Electrical Connectors	Electrical Connectors
Product Number	86P7437	TSW-113-13-G-S
Product Name	Header, 2.54Mm, Through Hole Vertical, 13 Position; Connector Systems Samtec	Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins
Connector Type	Board to Board Connector	Board to Board Connector; Rectangular Connectors, Heavy Duty; Wire to Board Connector