Samtec Inc. Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins TSM-110-01-S-DV-017

Description
Win Source Part Number: 1093688-TSM-110-01-S -DV-017 Category: Connectors, Interconnects>Rectan gular Connectors - Headers, Male Pins Series: TSM Number of Positions: 20 Connector Type: Header Contact Type: Male Pin Number of Positions Loaded: 19 Number of Rows: 2 Termination: Solder Fastening Type: Push-Pull Package: Tube Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Standard Package: 1 Mounting: SMD (SMT) Insulation Material: Liquid Crystal Polymer (LCP) Style: Board to Board or Cable Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Color: Black Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Insulation Height: 0.100" (2.54mm) Contact Shape: Square Temperature Range - Operating: -55°C ~ 125°C Contact Length - Mating: 0.230" (5.84mm) ECCN: EAR99 Fake Threat In the Open Market: 63 pct. MSL Level: 1 (Unlimited) HTSUS: 8536.69.4040 Mfr: Samtec Inc. Base Product Number: TSM-110
Request a Quote Datasheet
Description
Win Source Part Number: 1093688-TSM-110-01-S -DV-017 Category: Connectors, Interconnects>Rectan gular Connectors - Headers, Male Pins Series: TSM Number of Positions: 20 Connector Type: Header Contact Type: Male Pin Number of Positions Loaded: 19 Number of Rows: 2 Termination: Solder Fastening Type: Push-Pull Package: Tube Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Standard Package: 1 Mounting: SMD (SMT) Insulation Material: Liquid Crystal Polymer (LCP) Style: Board to Board or Cable Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Color: Black Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Insulation Height: 0.100" (2.54mm) Contact Shape: Square Temperature Range - Operating: -55°C ~ 125°C Contact Length - Mating: 0.230" (5.84mm) ECCN: EAR99 Fake Threat In the Open Market: 63 pct. MSL Level: 1 (Unlimited) HTSUS: 8536.69.4040 Mfr: Samtec Inc. Base Product Number: TSM-110
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins - 1093688-TSM-110-01-S-DV-017 - Win Source Electronics
Laguna Hills, CA, United States
Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins
1093688-TSM-110-01-S-DV-017
Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins 1093688-TSM-110-01-S-DV-017
Win Source Part Number: 1093688-TSM-110-01-S -DV-017 Category: Connectors, Interconnects>Rectan gular Connectors - Headers, Male Pins Series: TSM Number of Positions: 20 Connector Type: Header Contact Type: Male Pin Number of Positions Loaded: 19 Number of Rows: 2 Termination: Solder Fastening Type: Push-Pull Package: Tube Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Standard Package: 1 Mounting: SMD (SMT) Insulation Material: Liquid Crystal Polymer (LCP) Style: Board to Board or Cable Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Color: Black Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Insulation Height: 0.100" (2.54mm) Contact Shape: Square Temperature Range - Operating: -55°C ~ 125°C Contact Length - Mating: 0.230" (5.84mm) ECCN: EAR99 Fake Threat In the Open Market: 63 pct. MSL Level: 1 (Unlimited) HTSUS: 8536.69.4040 Mfr: Samtec Inc. Base Product Number: TSM-110

Win Source Part Number: 1093688-TSM-110-01-S-DV-017
Category: Connectors, Interconnects>Rectangular Connectors - Headers, Male Pins
Series: TSM
Number of Positions: 20
Connector Type: Header
Contact Type: Male Pin
Number of Positions Loaded: 19
Number of Rows: 2
Termination: Solder
Fastening Type: Push-Pull
Package: Tube
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Standard Package: 1
Mounting: SMD (SMT)
Insulation Material: Liquid Crystal Polymer (LCP)
Style: Board to Board or Cable
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Color: Black
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Temperature Range - Operating: -55°C ~ 125°C
Contact Length - Mating: 0.230" (5.84mm)
ECCN: EAR99
Fake Threat In the Open Market: 63 pct.
MSL Level: 1 (Unlimited)
HTSUS: 8536.69.4040
Mfr: Samtec Inc.
Base Product Number: TSM-110

Buy Now Datasheet

Technical Specifications

  Win Source Electronics
Product Category IC Interconnect Components
Product Number 1093688-TSM-110-01-S-DV-017
Product Name Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

Standard Array & Peripheral Test: Standard Test socket -  - Molex Signal Tech Industrial Ltd.
Specs
Product Type IC Socket
Socket Type Test
View Details
D-Sub Standard Board Mount - D09S23A6GX00LF - Amphenol Communications Solutions
Amphenol Communications Solutions
Specs
Product Type IC Socket
Mounting Solder
View Details
.040
Specs
Product Type PCB Pins
RoHS Compliant RoHS Compliant
Mounting Swage
View Details
IC Socket Adapters - 4017793 - RS Components, Ltd.
Specs
Product Type Package Adapters / Converters
Mounting Surface mount
Contacts Pitch 1.27 mm (0.0500 inches)
View Details