Samtec Inc. Header, 2.54Mm, Smd, 18 Position; Connector Systems Samtec TSM-109-01-T-DV

The Samtec TSM series header, specifically part number 29C9567, is a surface mount device (SMD) connector with a pitch spacing of 2.54 mm and 18 positions across 2 rows. It features a square post design with a post height that can vary based on the specific configuration. The header is constructed from black liquid crystal polymer for the insulator and phosphor bronze for the terminals, with plating options available in gold or tin over nickel. This product is rated for a voltage of 475 VAC when mated with compatible connectors such as BCS or SSM, and it supports operating temperatures ranging from -55 ¬8C to +105 ¬8C with tin plating, or -55 ¬8C to +125 ¬8C with gold plating. The header is RoHS compliant and lead-free solderable, making it suitable for environmentally conscious applications. It is designed for high mating cycles, ensuring durability in repeated use. The TSM series header is compatible with various board and cable mates, including SSW, SSQ, SSM, and IDSS, among others. This versatility makes it a suitable choice for a range of board-to-board applications.