The Header, 30 Contacts, 1 Row, Through Hole, 1.27 mm (part number 77P1133) is designed for board-to-board applications and features a pitch spacing of 1.27 mm. It is part of the TMS series and is RoHS compliant. The header is constructed to mate with SMS, SLM, and RSM connector systems. The insulator material is black liquid crystal polymer, while the terminal material is phosphor bronze with a plating option of either gold or tin over nickel. It has a current rating of 5 A per pin when two pins are powered and operates within a temperature range of -55 °C to +105 °C with tin plating, and -55 °C to +125 °C with gold plating. The product is lead-free solderable and is suitable for various applications requiring reliable connections.
HEADER, 30 CONTACTS, 1 ROW, THROUGH HOLE, 1.27 MM; Connector Systems:Board-to-Boa
.050" (1.27MM) MICRO HEADER
| Newark, An Avnet Company | Acme Chip Technology Co., Limited | |
|---|---|---|
| Product Category | Electrical Connectors | Electrical Connectors |
| Product Number | 77P1133 | TMS-130-02-S-S |
| Product Name | Header, 30 Contacts, 1 Row, Through Hole, 1.27 Mm; Connector Systems Samtec | Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins |
| Connector Type | Board to Board Connector | Board to Board Connector; Rectangular Connectors, Heavy Duty |
