Samtec Inc. Board to Board & Mezzanine Connectors TMS-110-03-G-D-RA

Description
Through-hole Micro Header, 0.050 x 0.10
Request a Quote
Description
Through-hole Micro Header, 0.050 x 0.10
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Board to Board & Mezzanine Connectors - TMS-110-03-G-D-RA - Powell Electronics, Inc.
Swedesboro, NJ, United States
Board to Board & Mezzanine Connectors
TMS-110-03-G-D-RA
Board to Board & Mezzanine Connectors TMS-110-03-G-D-RA
Through-hole Micro Header, 0.050 x 0.10

Through-hole Micro Header, 0.050 x 0.10

Buy Now

Technical Specifications

  Powell Electronics, Inc.
Product Category IC Interconnect Components
Product Number TMS-110-03-G-D-RA
Product Name Board to Board & Mezzanine Connectors
Product Type IC Headers
Unlock Full Specs
to access all available technical data

Similar Products

Levan Elastomeric Contact Test Socket: High Bandwidth Test Socket for IC Testing -  - Smiths Interconnect, a Molex company
Specs
Product Type IC Socket
Socket Type BGA; LGA; QFNL; Test
Operating Temperature -55 to 160 C (-67 to 320 F)
View Details
Backplane Conn, Header, 96Pos, 2Mm; Product Range Amphenol Communications Solutions - 62K7125 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
Mounting Press-fit / Solderless Technology; Press Fit
View Details
716 Series QFN/LGA Devices Open Top -  - Sensata Technologies
Specs
Product Type IC Socket
Contact Resistance 350 milliohms
Operating Temperature 125 C (257 F)
View Details
8+3 Pos. Male Cable Housing, Screw-Lok Panel Mount - G125-32496M2-03-08-00 - Harwin Plc
Specs
RoHS Compliant RoHS Compliant
Current Rating 10 amps
Operating Temperature -65 to 150 C (-85 to 302 F)
View Details