Through-Hole Micro Socket, 0.050 x 0.10
Win Source Part Number: 1153981-SMS-123-01-S
Category: Connectors, Interconnects>Rectan
Series: SMS
Number of Positions: 46
Connector Type: Receptacle
Contact Type: Forked
Number of Positions Loaded: All
Number of Rows: 2
Termination: Solder
Fastening Type: Push-Pull
Package: Tube
Contact Material: Phosphor Bronze
Standard Package: 1
Insulation Material: Liquid Crystal Polymer (LCP)
Style: Board to Board
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Color: Black
Mounting Type: Through Hole
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Post: 0.100" (2.54mm)
Insulation Height: 0.335" (8.51mm)
Contact Shape: Square
Temperature Range - Operating: -55°C ~ 125°C
Alternative Parts (Cross-Reference): SMS12301SD;
ECCN: EAR99
Fake Threat In the Open Market: 57 pct.
MSL Level: 1 (Unlimited)
Current Rating (Amps): 5A per Contact
HTSUS: 8536.69.4040
Mfr: Samtec Inc.
Base Product Number: SMS-123
| Powell Electronics, Inc. | Win Source Electronics | |
|---|---|---|
| Product Category | IC Interconnect Components | IC Interconnect Components |
| Product Number | SMS-123-01-S-D | 1153981-SMS-123-01-S-D |
| Product Name | Board to Board & Mezzanine Connectors | Connectors, Interconnects - Rectangular Connectors - Headers, Receptacles, Female Sockets |
| Product Type | IC Socket | IC Headers |
| Mounting | Through-Hole | Through-Hole; Through Hole |
| Socket Type | Receptacle | |
| Current Rating | 5 amps |
