Samtec Inc. Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) SEAFP-50-05.0-S-06

Win Source Part Number: 1350945-SEAFP-50-05.0-S-06
Category: Connectors, Interconnects - Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Series: SEARAY™ SEAFP
Number of Positions: 300
Pitch: 0.050" (1.27mm)
Connector Type: High Density Array, Female
Number of Rows: 6
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Package: Tray
Mated Stacking Heights: 7mm
Height Above Board: 0.197" (5.00mm)
Standard Package: 39
Mounting Type: Through Hole
ECCN: EAR99
Fake Threat In the Open Market: 65 pct.
MSL Level: 1 (Unlimited)
HTSUS: 8536.69.4040
Mfr: Samtec Inc.
Base Product Number: SEAFP-50

CONN HD ARRAY F 300POS PRESS-FIT Product overview: SEAFP-50-05.0-S-06 from Samtec, Inc. is an Electronic Connector for board-to-board, wire-to-board, backplane, terminal, cable, and industrial interconnect applications. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include connector, interconnect, header, socket, terminal block, Electronic Connector, Board to Board & Mezzanine Connectors. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 308-SEAFP-50-05.0-S-06 can be used for catalog matching and distributor lookup.