The Socket, 2.54mm, 3X23 Position, Elevated (part number 83T8190) from Samtec is designed for board-to-board applications with a pitch spacing of 2.54mm. It features three rows and a total of 69 contacts, making it suitable for various connectivity needs. The connector is through-hole mounted and is RoHS compliant. The insulator material is black glass-filled polyester, while the contacts are made of phosphor bronze with options for gold or tin plating over nickel. The current rating is 5.2 A per pin for the ESW series and 5.7 A per pin for the ESQ series, with a voltage rating of 550 VAC when mated with compatible connectors. The operating temperature range is from -55°C to +125°C with gold plating and -55°C to +105°C with tin plating. Insertion and withdrawal forces are specified, with standard insertion force averaging 6 oz for a single contact. The connector is designed for a maximum of 100 cycles with 10µ" gold plating. This product is suitable for applications requiring reliable connections in a compact form factor.
CONN SOCKET 69POS 0.1 GOLD PCB
SOCKET, 2.54MM, 3X23 POSITION, ELEVATED; Connector Systems:Board-to-Boa
| Acme Chip Technology Co., Limited | Newark, An Avnet Company | |
|---|---|---|
| Product Category | Electrical Connectors | Electrical Connectors |
| Product Number | ESQ-123-12-G-T | 83T8190 |
| Product Name | Connectors, Interconnects - Rectangular Connectors - Headers, Receptacles, Female Sockets | Socket, 2.54Mm, 3X23 Position, Elevated; Connector Systems Samtec |
| Connector Type | Board to Board Connector; Rectangular Connectors, Heavy Duty | Board to Board Connector |
| Termination | Solder | |
| Mounting | Through Hole | Through Hole Mount |
