Win Source Part Number: 1227653-BBL-123-T-F
Category: Connectors, Interconnects>Rectan
Series: BBL
Number of Positions: 23
Connector Type: Header
Contact Type: Male Pin
Number of Positions Loaded: All
Number of Rows: 1
Termination: Solder
Fastening Type: Push-Pull
Package: Bulk
Standard Package: 1
Insulation Material: Liquid Crystal Polymer (LCP)
Style: Board to Board
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Nickel
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Insulation Color: Black
Mounting Type: Through Hole
Shrouding: Unshrouded
Contact Length - Post: 0.125" (3.18mm)
Overall Contact Length: 0.332" (8.43mm)
Insulation Height: 0.085" (2.15mm)
Contact Shape: Circular
Temperature Range - Operating: -55°C ~ 125°C
Contact Length - Mating: 0.122" (3.10mm)
Alternative Parts (Cross-Reference): BBL123TF;
ECCN: EAR99
Fake Threat In the Open Market: 62 pct.
MSL Level: 1 (Unlimited)
REACH Status: REACH Unaffected
HTSUS: 8536.69.4040
Mfr: Samtec Inc.
Other Names: SAM1003-23
Base Product Number: BBL-123
HEADER, 2.54MM, LOW PROFILE, 23 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:23Contacts;
| Win Source Electronics | Newark, An Avnet Company | |
|---|---|---|
| Product Category | IC Interconnect Components | IC Interconnect Components |
| Product Number | 1227653-BBL-123-T-F | 11P3098 |
| Product Name | Connectors, Interconnects - Rectangular Connectors - Headers, Male Pins | Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec |
| Product Type | IC Headers | IC Headers |
| Mounting | Through-Hole; Through Hole | Through-Hole; Through Hole |
| Operating Temperature | -55 to 125 C (-67 to 257 F) | |
| Contact Plating | Tin |
